公开(公告)号：US20210331936A1

公开(公告)日：2021-10-28

申请号：US16332125

申请日：2018-07-17

Applicant: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei LI ,  Pan GUO ,  Yanqing CHEN ,  Ning WANG ,  Weida QIN ,  Haoyi XIN ,  Yanfeng LI ,  Chao LI ,  Yongchao WANG

IPC: C01G45/12 ,  H05K1/02 ,  C23C14/08 ,  C23C14/34 ,  C23C14/35

Abstract: A negative thermal expansion material and a preparation method thereof, and a negative thermal expansion film and a preparation method thereof are provided. The negative thermal expansion material includes Eu0.85Cu0.15MnO3-δ, wherein 0≤δ≤2.