公开(公告)号：US20170074633A1

公开(公告)日：2017-03-16

申请号：US15122731

申请日：2015-09-15

Applicant: Boe Technology Group Co., Ltd.

Inventor： Jinqian Wang ,  Lu Wang ,  Yujun Zhang

IPC: G01B7/06 ,  G01B7/16

CPC classification number: G01B7/06 ,  G01B5/066 ,  G01B7/085 ,  G01B7/16

Abstract: The embodiments of the invention disclose a device for film thickness measurement and a method for film thickness measurement. The device comprises a planar indenter, a collecting unit and a processing unit. The planar indenter comprises a base plate and a piezoelectric film layer. The collecting unit comprises a plurality of collecting circuits evenly distributed above the piezoelectric film layer and spaced from each other. The collecting circuits are used for collecting current signals generated when the piezoelectric film layer deforms at positions corresponding to the collecting circuits. The processing unit is used for calculating a film thickness of the film sample to be measured based on the current signals collected by each of the collecting circuits.

Abstract translation: 本发明的实施例公开了一种用于膜厚度测量的装置和用于膜厚测量的方法。 该装置包括平面压头，收集单元和处理单元。 平面压头包括基板和压电膜层。 收集单元包括均匀地分布在压电膜层上方并彼此间隔开的多个收集电路。 集电电路用于收集当压电薄膜层在与集电电路相对应的位置变形时产生的电流信号。 处理单元用于基于由每个集电电路收集的电流信号计算要测量的膜样品的膜厚度。