公开(公告)号：US20200015396A1

公开(公告)日：2020-01-09

申请号：US16574412

申请日：2019-09-18

Applicant: CKD Corporation

Inventor： Ikuo Futamura ,  Tsuyoshi Ohyama ,  Norihiko Sakaida ,  Kazuyoshi Kikuchi

IPC: H05K13/08 ,  H05K3/34 ,  B23K31/02 ,  G01B11/25 ,  G01B11/06 ,  G01N21/95 ,  G06T7/00 ,  G06T7/50

Abstract: A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.