Abstract:
An IC socket (1) for receiving an IC package having a plurality of pins extending downwardly includes a base (2), a plurality of terminals (7) received in the base, a cover (5) mounted upon the base (2), and a cam (6). The cover (5) includes a carrying section (50) for carrying the IC package and a cam-receiving section (51). The carrying section (50) forms a plurality of through holes (500) for insertion of the pins of the IC package. The cam (6) is disposed at the cam-receiving section (51) for actuating the cover (5) to move with respect to the base (2) in a first direction A. The cam (6) is offset from a central line CL of the carrying section (50) which extends along the first direction A.
Abstract:
An electrical connector assembly mounted on a printed circuit board (PCB) includes an insulating housing. The insulating housing includes a base with opposite front and rear end regions and a plurality of side walls upwardly extending from the base. The base cooperates with the side walls to commonly define a first receiving room. A notch defined in the front region of the base forms a second receiving room under the first receiving room. Said second receiving room is smaller than the first receiving room in both the front-to-back direction and a transverse direction perpendicular to said front-to-back direction. No portions of said contacts are located in the second receiving room so as to allow an optoelectronic module including a first portion and a second portion to be snugly received in the first receiving room and the second receiving room respectively, the second portion is attached to the first portion and supported on a top surface of the PCB.
Abstract:
A zero insertion force (ZIF) socket assembly comprises a ZIF socket and a pick-up cap. The ZIF socket includes a base, a cover, and a cam assembled to the base and rotated for driving the cover to move relative to the base between an opened position and a closed position. The pick-up cap is mounted to the ZIF socket and has a lock-up abutting against the cam for preventing the cam from rotating.
Abstract:
An electrical contact material includes a base material, a first number of plating layers forming a contact section and a second number of plating layers forming a soldering section, respectively. The second number of plating layers is provided on the base material and includes a Ni-plating layer directly on the base material and an organic antioxidant-plating layer on said Ni-plating layer.
Abstract:
An IC socket (1) for receiving an IC package having a plurality of pins extending downwardly includes a base (2), a plurality of terminals (7) received in the base, a cover (5) mounted upon the base (2), and a cam (6). The cover (5) includes a carrying section (50) for carrying the IC package and a cam-receiving section (51). The carrying section (50) forms a plurality of through holes (500) for insertion of the pins of the IC package. The cam (6) is disposed at the cam-receiving section (51) for actuating the cover (5) to move with respect to the base (2) in a first direction A. The cam (6) is offset from a central line CL of the carrying section (50) which extends along the first direction A.