公开(公告)号：US20130306277A1

公开(公告)日：2013-11-21

申请号：US13473611

申请日：2012-05-17

Applicant: Chih-Peng Chen

Inventor： Chih-Peng Chen

IPC: F28D15/04 ,  F28F13/00

CPC classification number: F28F1/12 ,  F28D15/0275 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal module structure includes a main body and at least one heat pipe. The main body has a base section and an extension section. Multiple radiating fins extend from a circumference of the extension section. The heat pipe is assembled with the main body. The heat pipe has a heat absorption end and a heat dissipation end. The thermal module structure has lower thermal resistance so that the heat dissipation effect of the thermal module structure is greatly enhanced. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened.

Abstract translation: 热模块结构包括主体和至少一个热管。 主体具有基部和延伸部。 多个辐射翅片从延伸部分的圆周延伸。 热管与主体组装。 热管具有吸热端和散热端。 热模块结构具有较低的热阻，从而大大提高了热模块结构的散热效果。 此外，热模块结构的制造成本降低，并且热模块结构的制造时间缩短。

公开(公告)号：US20130126131A1

公开(公告)日：2013-05-23

申请号：US13299690

申请日：2011-11-18

Applicant: Chih-Peng Chen

Inventor： Chih-Peng Chen

IPC: F28D15/04

CPC classification number: F28D15/046

Abstract: A heat pipe structure includes a first tubular body and a second tubular body. The first tubular body has a first chamber and a working fluid. A first capillary structure is disposed on outer circumference of the second tubular body. The second tubular body is disposed in the first chamber and has a second chamber. In the heat pipe structure, the vapor-phase working fluid flows within the first chamber, while the liquid-phase working fluid flows within the second chamber in separation from the vapor-phase working fluid. Accordingly, the impedance against the vapor is greatly reduced and the heat transfer efficiency is greatly enhanced to achieve excellent heat dissipation effect.

Abstract translation: 热管结构包括第一管状体和第二管状体。 第一管状体具有第一室和工作流体。 第一毛细结构设置在第二管状体的外周上。 第二管状体设置在第一室中并具有第二室。 在热管结构中，气相工作流体在第一室内流动，而液相工作流体在与气相工作流体分离的第二室内流动。 因此，大大降低了对蒸汽的阻抗，大大提高了传热效率，达到优异的散热效果。

公开(公告)号：US20130014921A1

公开(公告)日：2013-01-17

申请号：US13182715

申请日：2011-07-14

Applicant: Chih-Peng Chen ,  Jhao-Ying Huang

Inventor： Chih-Peng Chen ,  Jhao-Ying Huang

IPC: F28F7/00 ,  F28F13/12

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An air flow guiding structure includes a plurality of straight radiating fins being parallelly spaced to define an air flow passage between any two adjacent ones of the straight radiating fins; a plurality of first oblique sections extended from first ends of at least some of the straight radiating fins, such that a first air flow guiding passage communicating with the air flow passage is defined between any two adjacent ones of the first oblique sections; and a plurality of second oblique sections extended from opposite second ends of at least some of the straight radiating fins, such that a second air flow guiding passage communicating with the air flow passage is defined between any two adjacent ones of the second oblique sections. With these arrangements, air flows can be quickly guided into and out of the air flow passages to improve flow field and achieve best heat dissipation effect.

Abstract translation: 空气流引导结构包括多个直的散热片，其平行地间隔开以限定任何两个相邻的直的散热片之间的空气流动通道; 多个第一倾斜部分从至少一些直的散热片的第一端延伸，使得与任何两个相邻的第一倾斜部分之间限定与空气流动通道连通的第一气流引导通道; 以及多个第二倾斜部分，其从至少一些所述直的散热片的相对的第二端延伸，使得与所述空气流动通道连通的第二气流引导通道限定在任何两个相邻的所述第二倾斜部分之间。 通过这些布置，可以将空气流快速地引导进出气流通道，以改善流场并实现最佳的散热效果。

公开(公告)号：US20120111537A1

公开(公告)日：2012-05-10

申请号：US12940035

申请日：2010-11-04

Applicant: Chih-Peng Chen

Inventor： Chih-Peng Chen

IPC: F28D15/02

CPC classification number: F28D15/0275

Abstract: A flexible heat dissipation module comprises at least one first heat pipe, one second heat pipe, and one flexible component. The first heat pipe includes a first heat absorbing end and a first heat dissipating end; the second heat pipe includes a second heat absorbing end and a second heat dissipating end. The flexible component includes a first joining part, a second joining part, and a flexible area formed in between the first and the second joining part, wherein the first and the second joining parts are attached respectively to the first heat dissipating end of the first heat pipe and the second heat absorbing end of the second heat pipe. With the disposition of flexible components, the flexible heat module according to the present invention has wider installation applicability and more flexible programmability to adapt to existing narrow device space.

Abstract translation: 柔性散热模块包括至少一个第一热管，一个第二热管和一个柔性部件。 第一热管包括第一吸热端和第一散热端; 第二热管包括第二吸热端和第二散热端。 柔性部件包括第一接合部分，第二接合部分和形成在第一和第二接合部分之间的柔性区域，其中第一和第二接合部分分别附接到第一热量的第一散热端 管和第二热管的第二吸热端。 通过柔性部件的配置，根据本发明的柔性热模块具有更宽的安装适用性和更灵活的可编程性，以适应现有的狭窄设备空间。

公开(公告)号：US20080142812A1

公开(公告)日：2008-06-19

申请号：US11984136

申请日：2007-11-14

Applicant: Hsiao-Kuo Chang ,  Chih-Peng Chen ,  Chih-Wei Hsu

Inventor： Hsiao-Kuo Chang ,  Chih-Peng Chen ,  Chih-Wei Hsu

IPC: H01L33/00

CPC classification number: H01L33/007

Abstract: A light emitting diode device and a method for manufacturing the same are disclosed. The method comprises following steps: (A) providing a substrate; (B) forming a SiC film on the surface of the substrate; (C) forming a diamond layer on the surface of the SiC film and removing the substrate, wherein the diamond layer has a first surface and a second surface adjacent to the surface of the SiC film; (D) forming a semiconductor epitaxy layer on the surface of SiC film by epitaxial growth process; and (E) forming a first electrode on the surface of the semiconductor epitaxy layer and forming a metal layer on the first surface of the diamond layer. Accordingly, the manufacturing method of the present invention can efficiently reduce manufacturing cost and simplify manufacturing process to provide LEDs with high heat dissipation efficiency and a high-quality epitaxy layer.

Abstract translation: 公开了一种发光二极管装置及其制造方法。 该方法包括以下步骤：（A）提供衬底; （B）在所述基板的表面上形成SiC膜; （C）在所述SiC膜的表面上形成金刚石层并除去所述基板，其中所述金刚石层具有与所述SiC膜的表面相邻的第一表面和第二表面; （D）通过外延生长工艺在SiC膜的表面上形成半导体外延层; 和（E）在所述半导体外延层的表面上形成第一电极，并在所述金刚石层的第一表面上形成金属层。 因此，本发明的制造方法可以有效地降低制造成本并简化制造工艺，以提供具有高散热效率的LED和高质量的外延层。