INTEGRAL ELECTRODE PLACEMENT AND CONNECTION SYSTEMS
    11.
    发明申请
    INTEGRAL ELECTRODE PLACEMENT AND CONNECTION SYSTEMS 有权
    集成电极放置和连接系统

    公开(公告)号:US20100262140A1

    公开(公告)日:2010-10-14

    申请号:US12778907

    申请日:2010-05-12

    IPC分类号: A61B18/14

    摘要: Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Electrodes may also be formed on flexible circuit assemblies integrated within or along the hood. The circuit assemblies may also provide structural support to the hood during delivery and/or deployment. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.

    摘要翻译: 描述了电极放置和连接系统,其允许位于经受各种机械应力的基板上的一个或多个电极的电连接和维护。 电极也可以形成在集成在罩内或沿着罩的柔性电路组件上。 电路组件还可以在传送和/或展开期间向罩提供结构支撑。 这样的系统可以包括具有孔的成像罩,透明液体通过所述孔流动,并且一个或多个电极沿着或围绕罩定位。 由于罩被配置在低轮廓和打开的构型之间,尽管机械应力受到电极及其连接,但是这些电极可以保持电耦合。