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公开(公告)号：US10921159B1
公开(公告)日：2021-02-16
申请号：US16299565
申请日：2019-03-12
Inventor： Tejasvi Das , Zhong You , Siddharth Maru , Eric J. King , Johann G. Gaboriau , Luke Lapointe , Matthew Beardsworth
Abstract: A system may include a first resistive-inductive-capacitive sensor, a second resistive-inductive-capacitive sensor, and a measurement circuit communicatively coupled to the first resistive-inductive-capacitive sensor and the second resistive-inductive-capacitive sensor and configured to measure first phase information associated with the first resistive-inductive-capacitive sensor, measure second phase information associated with the second resistive-inductive-capacitive sensor, and based on the first phase information and the second phase information, determine a displacement of a mechanical member relative to the first resistive-inductive-capacitive sensor.
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12.发明公开公开(公告)号：US20240053425A1
公开(公告)日：2024-02-15
申请号：US17884521
申请日：2022-08-09
Inventor： Vamsikrishna Parupalli , Zhong You
CPC classification number: G01R35/005 , G01R27/16
Abstract: An integrated circuit (IC) provides on-line, wafer-level, die-level, or package-level thermal calibration of an integrated thin-film resistor, by thermally enclosing the thin-film resistor with metal layers formed above and below the thin-film resistor along its length and width. Metal vias thermally couple the metal layers to the substrate to at least partially equalize the temperature of the metal layers and the thin-film resistor and the substrate. A controllable heat source, which may be provided by another thin-film resistor integrated on or below the substrate, and a reference temperature sensor provide heating/calibration measurement of the resistance of the thin-film resistor over a range of temperature. The reference temperature sensor may be provided within the IC, for example, integrated on the substrate or packaged with the die containing the thin-film resistor, or may be otherwise thermally coupled to the metal layers, e.g., by an extension of one of the metal layers.
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公开(公告)号：US11119138B1
公开(公告)日：2021-09-14
申请号：US16838405
申请日：2020-04-02
Inventor： Vikrant Arumugam , Amar Vellanki , Vamsikrishna Parupalli , Zhong You , Johann G. Gaboriau , John L. Melanson
IPC: G01R27/26
Abstract: A method may include applying an excitation signal to a capacitor of the capacitive sensor which causes generation of a modulated signal from an input signal indicative of a variance in a capacitance of the capacitor, detecting the modulated signal with a detector to generate a detected modulated signal that has a phase shift relative to the excitation signal, demodulating the detected modulated signal into an in-phase component and a quadrature component using a reference signal, nullifying the quadrature component by setting a phase of the reference signal relative to the excitation signal to compensate for the phase shift, and outputting the in-phase component as an unmodulated output signal representative of the capacitance.
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14.发明授权公开(公告)号：US11016572B2
公开(公告)日：2021-05-25
申请号：US16875006
申请日：2020-05-15
Inventor： Srdjan Marijanovic , Drew Kinney , Luke Lapointe , Siddharth Maru , Tejasvi Das , Anthony S. Doy , Zhong You
Abstract: A system may include a tactile actuator for providing tactile feedback and a resonant phase sensing system. The resonant phase sensing system may include a resistive-inductive-capacitive sensor and a measurement circuit communicatively coupled to the resistive-inductive-capacitive sensor and the tactile actuator. The resistive-inductive-capacitive sensor may be configured to measure phase information associated with the resistive-inductive-capacitive sensor, based on the phase information, detect an indication of human interaction with the system proximate to the resistive-inductive-capacitive sensor, and trigger the tactile actuator to generate tactile feedback responsive to detecting the indication of human interaction.
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公开(公告)号：US20210075384A1
公开(公告)日：2021-03-11
申请号：US16562116
申请日：2019-09-05
Inventor： Frank Cheng , Ruoxin Jiang , Zhong You
Abstract: An apparatus measures a speaker impedance. A DAC converts a known digital input signal to an audio frequency first analog voltage signal. Resistors with known resistance attenuate the first analog voltage signal to generate a current. The known resistance effectively determines the current because the known resistance is high relative to the speaker impedance. The current is sourced into the speaker to generate a second analog voltage signal. The known resistance is sufficiently high to cause the second analog voltage signal to be inaudible as transduced by the speaker. An amplifier amplifies the second analog voltage signal with a known gain to generate a third analog voltage signal. An ADC converts the third analog voltage signal to a digital output signal. A processing element calculates the impedance of the speaker proportional to the digital output signal based on the known digital input signal, the known resistance, and the known gain.
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Patent Agency Ranking
公开(公告)号：US12295102B1
公开(公告)日：2025-05-06
申请号：US16299648
申请日：2019-03-12
Inventor： Zhong You , Emmanuel Marchais , Robert G. Kratsas , Anthony S. Doy
Abstract: A method may include forming an inductor comprising a plurality of inductor coils comprising a plurality of first inductor coils and a plurality of second inductor coils, each inductor coil comprising a spiraling wire of electrically-conductive material wherein the wire of electrically-conductive material is arranged substantially in a plane, wherein the plurality of first inductor coils and the plurality of second inductor coils are electrically coupled to one another and arranged with respect to one another such that within the plane, electrical current flowing through the inductor flows clockwise in the first inductor coils, within the plane, electrical current flowing through the inductor flows counterclockwise in the second inductor coils, each first inductor coil is adjacent to at least one second inductor coil, and each second inductor coil is adjacent to at least one first inductor coil.
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公开(公告)号：US12130159B2
公开(公告)日：2024-10-29
申请号：US16532850
申请日：2019-08-06
Inventor： Siddharth Maru , Tejasvi Das , Zhong You , Johann G. Gaboriau , Matthew Beardsworth , Gregory C. Yancey
CPC classification number: G01D5/243 , G01D5/14 , G01D5/16 , G01D5/20 , G01D5/24 , G06F3/01 , H03K17/9522 , H03K17/9537
Abstract: A system may include a resistive-inductive-capacitive sensor, a measurement circuit communicatively coupled to the resistive-inductive-capacitive sensor, and a filter communicatively coupled to the measurement circuit. The measurement circuit may be configured to measure phase information associated with the resistive-inductive-capacitive sensor and based on the phase information, determine a displacement of a mechanical member relative to the resistive-inductive-capacitive sensor. The filter may be configured to isolate changes to the displacement which are significantly slower than an expected change to the displacement in response to a human interaction with the mechanical member.
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18.发明授权公开(公告)号：US12066514B2
公开(公告)日：2024-08-20
申请号：US17884521
申请日：2022-08-09
Inventor： Vamsikrishna Parupalli , Zhong You
CPC classification number: G01R35/005 , G01R27/16
Abstract: An integrated circuit (IC) provides on-line, wafer-level, die-level, or package-level thermal calibration of an integrated thin-film resistor, by thermally enclosing the thin-film resistor with metal layers formed above and below the thin-film resistor along its length and width. Metal vias thermally couple the metal layers to the substrate to at least partially equalize the temperature of the metal layers and the thin-film resistor and the substrate. A controllable heat source, which may be provided by another thin-film resistor integrated on or below the substrate, and a reference temperature sensor provide heating/calibration measurement of the resistance of the thin-film resistor over a range of temperature. The reference temperature sensor may be provided within the IC, for example, integrated on the substrate or packaged with the die containing the thin-film resistor, or may be otherwise thermally coupled to the metal layers, e.g., by an extension of one of the metal layers.
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公开(公告)号：US20230366754A1
公开(公告)日：2023-11-16
申请号：US17884517
申请日：2022-08-09
Inventor： Zhong You , Vamsikrishna Parupalli , Johann G. Gaboriau
CPC classification number: G01K15/005 , G01K7/16 , G01K2219/00
Abstract: A system and method provide on-line, wafer-level, die-level, or package-level thermal calibration of an integrated measurement resistor with a single temperature insertion. The system includes a measurement resistor integrated on a substrate with an unknown temperature coefficient and a temperature reference sensor thermally coupled to the measurement resistor. A measurement circuit measures an indication of a resistance of the measurement resistor. An electrically-controllable integrated heat source is operated by a controller to change a temperature of the measurement resistor and the temperature reference sensor and stores values of the resistance indication and the sensed temperature corresponding to multiple temperatures of the temperature of the measurement resistor and the temperature reference sensor. The controller generates or approximates a mathematical relationship between the resistance of the measurement resistor and the temperature of the measurement resistor and the temperature reference sensor from the stored values.
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20.发明授权公开(公告)号：US11537242B2
公开(公告)日：2022-12-27
申请号：US16294217
申请日：2019-03-06
Inventor： Tejasvi Das , Siddharth Maru , Zhong You , Luke Lapointe
Abstract: A system may include a resistive-inductive-capacitive sensor, a measurement circuit communicatively coupled to the resistive-inductive-capacitive sensor and configured to measure phase information associated with the resistive-inductive-capacitive sensor and based on the phase information, determine a displacement of a mechanical member relative to the resistive-inductive-capacitive sensor. The system may also include a Q factor enhancer communicatively coupled to the resistive-inductive-capacitive sensor and configured to control a Q factor of the resistive-inductive-capacitive sensor.
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