公开(公告)号：US10128034B2

公开(公告)日：2018-11-13

申请号：US14839587

申请日：2015-08-28

Applicant: DELTA ELECTRONICS, INC.

Inventor： Chao-Wen Lu ,  Chun-Chih Wang ,  Ding-Wei Chiu ,  Chung-Hung Tang

IPC: H05K7/20 ,  H01F27/08 ,  H01L23/427

Abstract: A heat dissipation device is applied to an electronic device and comprises a heat conduction plate, at least an induction coil and a first heat dissipation plate. The heat conduction plate receives the heat provided by a heat source and includes a first contact element disposed on a first surface of the heat conduction plate. The induction coil is disposed at the heat conduction plate. The first heat dissipation plate is disposed at the first contact element of the heat conduction plate. The first heat dissipation plate and the heat conduction plate form a gap. The first heat dissipation plate includes at least a first magnetic element disposed opposite the induction coil.

公开(公告)号：US09635781B2

公开(公告)日：2017-04-25

申请号：US14463275

申请日：2014-08-19

Applicant: DELTA ELECTRONICS, INC.

Inventor： Chao-Wen Lu ,  Chun-Chih Wang ,  Ding-Wei Chiu

IPC: G06F1/20 ,  H05K7/20

CPC classification number: H05K7/20136 ,  G06F1/203 ,  H05K7/20154 ,  H05K7/2049

Abstract: A heat dissipating device for dissipating the heat produced by a heating element is disclosed. The heat dissipating device includes a fixing assembly, two moving assemblies and an elastic assembly. The fixing assembly has a thermal conductive member. Each moving assembly has a mass body and is relatively moveable with respect to the fixing assembly. The two moving assemblies are disposed on two opposite sides of the fixing assembly, respectively, and each moving assembly forms a moving space with respect to the fixing assembly. The elastic assembly connects the fixing assembly to the two moving assemblies.