公开(公告)号：US20180070480A1

公开(公告)日：2018-03-08

申请号：US15695825

申请日：2017-09-05

Applicant: DENSO CORPORATION ,  TOKIN CORPORATION

Inventor： Naoki HIRASAWA ,  Ryota TANABE ,  Takashi KAWASHIMA ,  Takashi YANBE ,  Masahiro KONDOU

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  B60L15/007 ,  B60L2210/10 ,  B60L2270/142 ,  B60L2270/145 ,  H01L23/473 ,  H05K7/20263 ,  H05K7/20854

Abstract: A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.