ENCAPSULATION STRUCTURE FOR AN OPTOELECTRONIC COMPONENT AND METHOD FOR ENCAPSULATING AN OPTOELECTRONIC COMPONENT
    11.
    发明申请
    ENCAPSULATION STRUCTURE FOR AN OPTOELECTRONIC COMPONENT AND METHOD FOR ENCAPSULATING AN OPTOELECTRONIC COMPONENT 有权
    光电组件的封装结构和封装光电元件的方法

    公开(公告)号:US20140210112A1

    公开(公告)日:2014-07-31

    申请号:US14232632

    申请日:2012-07-05

    Applicant: Thilo Reusch

    Inventor: Thilo Reusch

    CPC classification number: H01L51/5256 H01L51/448 H01L51/5253 H05B33/04

    Abstract: An encapsulation structure for an optoelectronic component may include: a barrier thin-film layer for protecting an optoelectronic component against chemical impurities; a cover layer applied above the barrier thin-film layer and serving for protecting the barrier thin-film layer against mechanical damage; and an intermediate layer applied on the barrier thin-film layer between barrier thin-film layer and cover layer and including a curable material designed such that when the non-cured intermediate layer is applied to the barrier thin-film layer, particle impurities at the surface of the barrier thin-film layer are enclosed by the intermediate layer and the applied intermediate layer has a substantially planar surface, and that after the intermediate layer has been cured, mechanical loads on the barrier thin-film layer as a result of particle impurities during the application of the cover layer are reduced by the intermediate layer.

    Abstract translation: 用于光电子部件的封装结构可以包括:用于保护光电子部件免受化学杂质的阻挡薄膜层; 覆盖层,其被施加在阻挡薄膜层上方,用于保护阻挡薄膜层免受机械损伤; 以及施加在阻挡薄膜层和覆盖层之间的阻挡薄膜层上的中间层,并且包括设计成使得当将未固化的中间层施加到阻挡薄膜层时的可固化材料, 阻挡薄膜层的表面被中间层包围,所施加的中间层具有基本平坦的表面,并且在中间层固化之后,由于颗粒杂质导致阻挡薄膜层上的机械载荷 在覆盖层的应用期间,中间层被还原。

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