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公开(公告)号：US20150191610A1
公开(公告)日：2015-07-09
申请号：US14662421
申请日：2015-03-19
Applicant: FUJIFILM Corporation
Inventor： Yasuaki MATSUSHITA , Yasuhiro MITAMURA
CPC classification number: C09D5/24 , H01B1/22 , H05K1/095 , H05K1/097 , H05K2201/0769
Abstract: There are provided a conductive paste which can form a silver layer of excellent migration resistance and conductivity in a simple manner, and a printed wiring board having a silver layer formed of the conductive paste. The conductive paste comprises silver particles and a migration inhibitor, which is present at an amount of 12 parts by mass to 40 parts by mass based on 100 parts by mass of the silver particles and represented by Formula (1):
Abstract translation: 提供一种能够以简单的方式形成具有优异的耐迁移性和导电性的银层的导电性糊料，以及具有由导电性糊料形成的银层的印刷线路板。 导电性糊料包含银粒子和迁移抑制剂，其相对于100质量份的银粒子为12质量份〜40质量份，由式（1）表示：
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