公开(公告)号：US20230254983A1

公开(公告)日：2023-08-10

申请号：US18134744

申请日：2023-04-14

Applicant: TOPPAN INC.

Inventor： Takeshi TAMURA ,  Tetsuyuki TSUCHIDA

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/46 ,  H05K1/02 ,  H05K2203/1338 ,  H05K2201/0769

Abstract: A wiring board capable of suppressing migration between wires and to provide a method of producing the same, in a method of producing a wiring board provided with a first wiring board in which a first wiring layer is formed, and a second wiring board in which a second wiring layer finer than the first wiring layer is formed, the second wiring board is formed by performing steps of forming a first insulating resin layer provided with a wiring pattern and openings, forming a first inorganic insulating film on the first insulating resin layer, forming a first conductor layer corresponding to the wiring pattern and the openings on the inorganic insulating film, and forming a second inorganic insulating film on the first conductor layer.

公开(公告)号：US20180035537A1

公开(公告)日：2018-02-01

申请号：US15543264

申请日：2016-01-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Tatsuya KATOH ,  Masanori ITO ,  Masaki KUTSUNA

IPC: H05K1/03 ,  H05K3/12 ,  C04B35/63 ,  H05K3/46 ,  H01L23/15 ,  H05K1/09 ,  H05K3/28

CPC classification number: H05K3/40 ,  B32B9/005 ,  B32B2307/202 ,  C03C4/14 ,  C03C10/0054 ,  C03C2204/00 ,  C04B35/6303 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/1291 ,  H05K3/28 ,  H05K3/285 ,  H05K3/321 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4664 ,  H05K2201/017 ,  H05K2201/0769 ,  H05K2203/1126 ,  Y10T29/49163

Abstract: A method of manufacturing a ceramic substrate includes the steps of preparing a ceramic paste in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of a glass ceramic, applying the ceramic paste to a green sheet which is to become a ceramic layer after firing, applying a conductor paste which is to become a conductor trace after firing to the ceramic paste having been applied to the green sheet, and firing the green sheet carrying the ceramic paste and the conductor paste applied thereto.

公开(公告)号：US09736945B2

公开(公告)日：2017-08-15

申请号：US14813218

申请日：2015-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Nobuya Takahashi

IPC: H05K1/09 ,  H05K3/18 ,  H05K3/16 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/40 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/48 ,  H01L23/538

CPC classification number: H05K3/18 ,  H01L21/4857 ,  H01L23/49866 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/111 ,  H05K1/141 ,  H05K3/16 ,  H05K3/4007 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/0391 ,  H05K2201/0769 ,  H05K2201/09236 ,  H05K2201/0929 ,  H05K2201/094 ,  H05K2201/09654 ,  H05K2201/097 ,  H05K2201/09736 ,  H05K2201/098 ,  H01L2924/014

Abstract: A printed wiring board includes an insulation layer, conductive pads formed on the insulation layer and positioned to connect an electronic component, and a conductive wiring pattern including first and second conductive patterns and formed on the insulation layer such that the conductive wiring pattern is extending between the conductive pads. The first pattern includes first wiring lines, the second pattern includes second wiring lines, the first and second conductive patterns are formed such that the first wiring lines and the second wiring lines are alternately arrayed on the insulation layer, each of the first wiring lines includes a first metal layer formed on an interface with the insulation layer, each of the second wiring lines includes a second metal layer formed on an interface with the insulation layer, and the first metal layer includes a metal material which is different from a metal material forming the second metal layer.

公开(公告)号：US09532468B2

公开(公告)日：2016-12-27

申请号：US14549951

申请日：2014-11-21

Applicant: IBIDEN Co., Ltd.

Inventor： Masatoshi Kunieda ,  Makoto Terui ,  Ryoujiro Tominaga ,  Takashi Kariya

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  H05K1/18 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K3/4682 ,  H01L2224/16227 ,  H05K1/0256 ,  H05K1/0265 ,  H05K1/09 ,  H05K1/112 ,  H05K1/113 ,  H05K1/114 ,  H05K1/185 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/0352 ,  H05K2201/0391 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2201/094 ,  H05K2201/09736 ,  H05K2201/0989 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/2081 ,  H05K2203/1394 ,  Y02P70/611 ,  Y10T29/49155

Abstract: A wiring board includes a first resin insulating layer, conductor pads on the first insulating layer including first and second conductor pads, a second resin insulating layer on the first insulating layer covering the first and second pads, an outermost conductor layer on the second insulating layer including first and second outermost wiring layers, via conductors through the second insulating layer including a first via conductor connecting the first wiring layer and first pad and a second via conductor connecting the second wiring layer and second pad, and a solder resist layer on the second insulating layer such that the solder resist layer is covering the first wiring layer and has one or more openings exposing the second wiring layer. The first wiring layer includes first main metal, and the second wiring layer includes second main metal which is different from the first metal of the first wiring layer.

Abstract translation: 布线基板包括第一树脂绝缘层，第一绝缘层上包括第一和第二导体焊盘的导体焊盘，覆盖第一和第二焊盘的第一绝缘层上的第二树脂绝缘层，第二绝缘层上的最外层导体层 包括第一和第二最外面布线层，通过第二绝缘层的通孔导体包括连接第一布线层和第一焊盘的第一通孔导体和连接第二布线层和第二焊盘的第二通孔导体，以及在第二绝缘层上的阻焊层 绝缘层，使得阻焊层覆盖第一布线层并且具有暴露第二布线层的一个或多个开口。 第一布线层包括第一主金属，第二布线层包括与第一布线层的第一金属不同的第二主金属。

公开(公告)号：US20160349884A1

公开(公告)日：2016-12-01

申请号：US15234845

申请日：2016-08-11

Applicant: FUJIFILM Corporation

Inventor： Tasuku SATOU

IPC: G06F3/044 ,  H05K3/00 ,  H05K3/04 ,  H05K1/09

CPC classification number: G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/092 ,  H05K3/0058 ,  H05K3/04 ,  H05K3/1258 ,  H05K2201/0769 ,  H05K2201/09045 ,  H05K2203/0139 ,  H05K2203/124

Abstract: An object of the invention is to provide a conductive film that can prevent an operation error caused by ion migration and is suitable for, for example, a projected capacitive touch panel, a method for manufacturing the conductive film, and a touch panel using the conductive film. In the conductive film, a resin layer is laminated on a surface of a substrate. A mesh-shaped groove portion is formed in a surface of the resin layer. A thin metal wire is provided in the groove portion to form an electrode pattern. When a value indicating ion migration characteristics of the electrode pattern in a longitudinal direction is ML and a value indicating ion migration characteristics of the electrode pattern in a lateral direction is MS, a migration ratio obtained by dividing the larger of the two values ML and MS by the smaller value is in the range of 1.0 to 1.4.

Abstract translation: 本发明的目的是提供一种能够防止由离子迁移引起的操作误差的导电膜，并且适用于例如投射电容式触摸面板，导电膜的制造方法以及使用导电性的触摸面板 电影。 在导电膜中，在基板的表面层叠树脂层。 在树脂层的表面形成网状槽部。 在所述槽部中设置有细金属线，以形成电极图案。 当表示电极图案的长度方向的离子迁移特性的值为ML，表示电极图案的横向的离子迁移特性的值为MS时，通过将两个值ML和MS中的较大值分割而获得的迁移率 通过较小的值在1.0至1.4的范围内。

公开(公告)号：US20160021741A1

公开(公告)日：2016-01-21

申请号：US14869503

申请日：2015-09-29

Applicant: FUJIFILM Corporation

Inventor： Yasuaki MATSUSHITA ,  Tokihiko MATSUMURA

IPC: H05K1/09 ,  C09D5/24 ,  H01B1/22

CPC classification number: H01B1/22 ,  C08K3/08 ,  C08K5/02 ,  C08K5/13 ,  C08K5/32 ,  C08K5/3475 ,  C08K5/37 ,  C08K5/46 ,  C08K5/49 ,  C08K5/52 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0831 ,  C08K2003/085 ,  C09D1/00 ,  C09D5/24 ,  C09D7/40 ,  H01B3/445 ,  H05K1/09 ,  H05K1/092 ,  H05K3/125 ,  H05K3/282 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/0769

Abstract: A conductive film forming composition includes a fluorine atom-containing migration inhibitor and a metal particle, with the migration inhibitor including at least one selected from the group consisting of compounds represented by General Formulae (1) to (5), (22) and (23) as well as compounds having a group of General Formula (24) and a group of General Formula (25). The conductive film forming composition makes it possible to form a conductive film excellent in conductive characteristics and ion migration inhibiting function.

Abstract translation: 导电膜形成组合物包括含氟原子的迁移抑制剂和金属颗粒，迁移抑制剂包括选自由通式（1）至（5），（22）和（22）表示的化合物中的至少一种， 23）以及具有通式（24）的基团和通式（25）的基团的化合物。 导电膜形成组合物可以形成导电特性和离子迁移抑制功能优异的导电膜。

公开(公告)号：US20160014894A1

公开(公告)日：2016-01-14

申请号：US14864895

申请日：2015-09-25

Applicant: FUJIFILM CORPORATION

Inventor： YASUSHI ENDO ,  NOBUYUKI TADA ,  KENJI NAOI ,  TOMOHITO ASAI ,  HIDEO IKEDA ,  MICHIHIRO SHIBATA

IPC: H05K1/11 ,  H05K1/09

CPC classification number: H05K1/11 ,  C08F220/18 ,  C09J133/08 ,  C09J133/10 ,  C09J133/26 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0289 ,  H05K1/092 ,  H05K3/285 ,  H05K3/4673 ,  H05K2201/0108 ,  H05K2201/0761 ,  H05K2201/0769 ,  C08F2220/1858 ,  C08F220/20

Abstract: This wiring board is provided with: a plurality of metal wires disposed upon an insulating substrate; and a transparent adhesive agent layer which is disposed upon the metal wires, and which is in direct contact with the metal wires. The metal wires include: a first metal wire which has a pulse signal supplied thereto; and a second metal wire which has a fixed electric potential applied thereto. The pulse signal has a reference level identical to the fixed electric potential, and has a pulse train in which a plurality of pulses having a pulse width of not more than 3 msec are arranged, the integral time of the pulses in a period of 600 seconds being less than 60 seconds.

Abstract translation: 该布线板设置有：设置在绝缘基板上的多个金属线; 以及设置在金属线上并与金属线直接接触的透明粘合剂层。 金属线包括：具有供给脉冲信号的第一金属线; 以及施加有固定电位的第二金属线。 脉冲信号具有与固定电位相同的参考电平，并且具有脉冲序列，其中布置脉冲宽度不超过3毫秒的多个脉冲，脉冲在600秒的周期内的积分时间 小于60秒。

公开(公告)号：US20150287532A1

公开(公告)日：2015-10-08

申请号：US14667928

申请日：2015-03-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi ABE ,  Yoshiyuki NOMURA ,  Junichi SAITO

IPC: H01G4/224 ,  H01G4/008 ,  H01G4/248 ,  H01G4/12 ,  H05K1/18 ,  H01G4/30

CPC classification number: H01G4/224 ,  H01G2/065 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01G13/003 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/0769 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component includes a main body, first and second external electrodes, and a water-repellent film. The first and second external electrodes are provided on a portion of a surface of the main body. The water-repellent film is provided on another portion of the surface of the main body and on a surface of the first external electrode. The water-repellent film contains a non-cross-linked silicone resin. An angle of contact of water of about 25° C. with the water-repellent film is not less than about 100° and not greater than about 160°.

Abstract translation: 电子部件包括主体，第一和第二外部电极以及防水膜。 第一外部电极和第二外部电极设置在主体的表面的一部分上。 防水膜设置在主体的表面的另一部分和第一外部电极的表面上。 防水膜含有非交联的有机硅树脂。 约25℃的水与防水膜的接触角度不小于约100°且不大于约160°。

公开(公告)号：US20150275029A1

公开(公告)日：2015-10-01

申请号：US14728139

申请日：2015-06-02

Applicant: FUJIFILM CORPORATION

Inventor： Yasuaki MATSUSHITA ,  Toyohisa OYA ,  Tokihiko MATSUMURA

IPC: C09D137/00 ,  H01L23/10

CPC classification number: C09D137/00 ,  C08K5/101 ,  C08K5/3475 ,  C08K5/378 ,  C08K5/46 ,  C09D127/12 ,  H01L23/10 ,  H01L2924/0002 ,  H05K1/034 ,  H05K3/287 ,  H05K2201/015 ,  H05K2201/0769 ,  Y10T428/24917 ,  C08K5/0008 ,  H01L2924/00

Abstract: A sealing resin composition, which coats silver wiring or a laminate including the silver wiring, comprises: a fluorine-based resin (A); and a migration inhibitor (B) having a fluorine content rate of equal to or more than 35 mass % and less than 65 mass %, wherein the mass ratio ((B)/(A)) of the migration inhibitor (B) to the fluorine-based resin (A) is equal to or more than 0.0010 and less than 0.10.

Abstract translation: 包含银线的密封树脂组合物或包含银线的层压体包括：氟基树脂（A）; 和含氟率为35质量％以上且小于65质量％的迁移抑制剂（B），其中迁移抑制剂（B）的质量比（（B）/（A））与 氟系树脂（A）等于或大于0.0010且小于0.10。

公开(公告)号：US20150140293A1

公开(公告)日：2015-05-21

申请号：US14398616

申请日：2013-08-01

Applicant: Waseda University ,  Fuji Electric Co., Ltd.

Inventor： Yoshimichi Ohki ,  Yuichi Hirose ,  Genta Wada ,  Toshikatsu Tanaka ,  Kenji Okamoto

IPC: H05K1/05 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/056 ,  C09D7/67 ,  C09D7/68 ,  C09D7/69 ,  C09D163/00 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0769 ,  H05K2201/10106 ,  Y10T428/24893

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 μm with an average particle diameter (D50) of 500 nm to 20 μm, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract translation: 高导热性印刷电路板通过抑制铜离子的洗脱来防止电化学迁移。 印刷电路板是依次包括具有绝缘树脂层和铜箔层的金属基板的金属基印刷电路板。 在印刷电路板中，绝缘树脂层包含由平均粒径（D50）为1nm〜300nm的粒径为0.1nm〜600nm的无机粒子构成的第一无机填充材料和由 平均粒径（D50）为500nm〜20μm的粒径为100nm〜100μm的无机粒子，第一无机填充剂和第二无机填料均匀地分散在绝缘树脂层中。