中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

15 records (took 0.015 seconds)

    RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE
    11.
    发明申请
    RESIN COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE 有权

    公开(公告)号：US20220064444A1

    公开(公告)日：2022-03-03

    申请号：US17521859

    申请日：2021-11-09

    Applicant: FUJIFILM Corporation

    Inventor： Yuki NARA

    IPC: C08L79/08 ,  C08L39/00 ,  C08J5/18 ,  C03C17/32 ,  C08K5/00

    Abstract: Provided are a resin composition including a coloring material, a resin, and a solvent, in which, in a case where a film having a thickness of 0.60 μm is formed by heating the resin composition at 200° C. for 30 minutes, a rate of change ΔA in an absorbance of the film after performing a heating treatment of the film at 300° C. for 5 hours in a nitrogen atmosphere, which is represented by Expression (1), is 50% or less; a film formed of the resin composition; a color filter; a solid-state imaging element; and an image display device. In the following expression, ΔA is the rate of change in the absorbance of the film after the heating treatment, A1 is a maximum value of an absorbance of the film before the heating treatment in a wavelength range of 400 to 1100 nm, and A2 is an absorbance of the film after the heating treatment, and is an absorbance at a wavelength showing the maximum value of the absorbance of the film before the heating treatment in a wavelength range of 400 to 1100 nm. ΔA=|100−(A2/A1)×100|  (1)

    PHOTOSENSITIVE COLORING COMPOSITION AND METHOD OF MANUFACTURING OPTICAL FILTER
    13.
    发明申请
    PHOTOSENSITIVE COLORING COMPOSITION AND METHOD OF MANUFACTURING OPTICAL FILTER 审中-公开

    公开(公告)号：US20200225576A1

    公开(公告)日：2020-07-16

    申请号：US16826531

    申请日：2020-03-23

    Applicant: FUJIFILM Corporation

    Inventor： Takahiro OKAWARA ,  Yuki NARA

    IPC: G03F7/00 ,  G03F7/20

    Abstract: Provided is a photosensitive coloring composition with which a pixel having excellent adhesiveness with a support and excellent rectangularity can be formed. In addition, provided is also a method of manufacturing an optical filter including a pixel having excellent adhesiveness with a support and excellent rectangularity. This photosensitive coloring composition is a photosensitive coloring composition for exposure to light having a wavelength of 300 nm or shorter, the photosensitive coloring composition including a coloring material and a curable compound. In a case where a film having a thickness of 0.5 μm after drying is formed using the photosensitive coloring composition, an optical density of the above-described film with respect to light having a wavelength of 248 nm is 1.6 or higher. It is preferable that a content of the coloring material is 50 mass % or higher with respect to a total solid content of the photosensitive coloring composition.

    COMPOSITION, FILM FORMING METHOD, AND METHOD OF MANUFACTURING OPTICAL SENSOR
    14.
    发明申请
    COMPOSITION, FILM FORMING METHOD, AND METHOD OF MANUFACTURING OPTICAL SENSOR 审中-公开

    公开(公告)号：US20200148888A1

    公开(公告)日：2020-05-14

    申请号：US16744694

    申请日：2020-01-16

    Applicant: FUJIFILM Corporation

    Inventor： Takahiro OKAWARA ,  Yuki NARA

    IPC: C09D1/00 ,  C08K3/36 ,  C09D5/00 ,  C08K5/06 ,  C09D7/20

    Abstract: Provided is a composition with which a film having a lower refractive index and reduced defects can be formed. In addition, provided are a film forming method and a method of manufacturing an optical sensor. This composition includes colloidal silica particles and a solvent. In the colloidal silica particles, an average particle size D1 that is measured using a dynamic light scattering method is 25 to 1000 nm and a ratio D1/D2 of the average particle size D1 to an average particle size D2 that is obtained from a specific surface area of the colloidal silica particles measured using a nitrogen adsorption method is 3 or higher. The solvent includes a solvent A1 having a boiling point of 245° C. or higher and a solubility parameter of lower than 11.3 (cal/cm3)0.5 and a solvent A2 having a boiling point of 120° C. or higher and lower than 245° C. and a solubility parameter of 11.3 (cal/cm3)0.5 or higher.

Patent Agency Ranking