Abstract:
Provided is a photosensitive composition for exposure to light having a wavelength of 300 nm or shorter, the photosensitive composition including: a coloring material; and a polymerizable monomer, in which a total content of the polymerizable monomer and a photopolymerization initiator is 15 mass % or lower with respect to a total solid content of the photosensitive composition.
Abstract:
Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.
Abstract:
An object of the present invention is to provide a composition for forming a far-infrared radiation shielding layer which is able to form a layer having excellent far-infrared radiation shielding properties. A composition for forming a far-infrared radiation shielding layer of the present invention contains at least inorganic fine particles and a dispersant.
Abstract:
There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 μm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 μm or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.
Abstract:
Provided is a method of manufacturing an optical filter in which a pixel having excellent rectangularity can be accurately formed in a region that is partitioned by a partition wall or at a position corresponding to the region partitioned by the partition wall. The method of manufacturing an optical filter includes: forming a photosensitive coloring composition layer by applying a photosensitive coloring composition to a support, the support including a partition wall and a plurality of regions that are partitioned by the partition wall, and the photosensitive coloring composition including a coloring material and a curable compound and in which a content of the coloring material is 10 mass % or higher with respect to a total solid content; irradiating the photosensitive coloring composition layer with light having a wavelength of 300 nm or shorter using a scanner exposure device such that the photosensitive coloring composition layer is exposed in a pattern shape; and forming a pixel in the region partitioned by the partition wall or at a position corresponding to the region partitioned by the partition wall by removing a non-exposed portion of the photosensitive coloring composition layer by development.
Abstract:
Provided are an infrared-light-blocking composition capable of forming an infrared-light-blocking layer having excellent light-transmitting performance in the visible region and having excellent light-blocking performance in the infrared region; an infrared-light-blocking layer; an infrared cut-off filter; and a camera module. An infrared-light-blocking composition of the invention contains inorganic microparticles and a dispersing agent, and the infrared-light-blocking layer formed from the infrared-light-blocking composition has a transmittance at a wavelength of 1,000 nm of 60% or less, a transmittance at a wavelength of 1,100 nm of 50% or less, and a transmittance at a wavelength of 500 nm of 80% or more.
Abstract:
Provided are a resin composition including a coloring material, a resin, and a solvent, in which, in a case where a film having a thickness of 0.60 μm is formed by heating the resin composition at 200° C. for 30 minutes, a thickness of the film after performing a heating treatment of the film at 300° C. for 5 hours in a nitrogen atmosphere is 70% or more of a thickness of the film before the heating treatment; a film formed of the resin composition; a color filter; a solid-state imaging element; and an image display device.
Abstract:
Provided are a radiation-sensitive resin composition having good sensitivity and excellent temporal stability of the sensitivity, a cured film, a pattern forming method, a solid-state imaging device, and an image display device. The radiation-sensitive resin composition includes a resin, a polymerizable compound having an ethylenically unsaturated bond, a photopolymerization initiator, an organic solvent, and water, in which the photopolymerization initiator includes an oxime ester compound having at least one group selected from a branched alkyl group and a cyclic alkyl group, and the content of water is 0.1% to 2% by mass with respect to the mass of the radiation-sensitive resin composition.
Abstract:
A near-infrared blocking filter includes a near-infrared absorbing substance, has a film thickness of 300 μm or less, and has a visible light transmissivity in a wavelength range of 450 nm to 550 nm of 85% or more, a light transmissivity at a wavelength of 800 nm is 20% or less, and a light transmissivity at a wavelength of 850 nm is 20% or less.
Abstract:
A photosensitive composition for exposure to light having a wavelength of 300 nm or shorter, the photosensitive composition including: a coloring material; and a polymerizable monomer, in which the total content of the polymerizable monomer and a photopolymerization initiator is 15 mass % or lower with respect to the total solids content of the photosensitive composition.