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公开(公告)号：US09576177B2
公开(公告)日：2017-02-21
申请号：US14926327
申请日：2015-10-29
Applicant: FINGERPRINT CARDS AB
Inventor： Karl Lundahl
IPC: G06K9/00 , G06F3/044 , G06F3/0488 , G06K9/20
CPC classification number: G06K9/0002 , G06F3/044 , G06F3/0488 , G06K9/00053 , G06K9/209 , H01L27/14618 , H01L27/14678 , H01L2224/48471
Abstract: A fingerprint sensing device (and associated method of manufacturing) comprises a sensing chip arranged on a substrate with readout circuitry. The sensing chip comprising a plurality of sensing elements having a surface defining a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between a sensing element and a finger placed on the sensing device; bond wires arranged between bond pads located on the sensing chip on the substrate, respectively, to electrically connect the sensing chip to the readout circuitry. A portion of the bond wire protrudes above the chip and an adhesive is arranged on the sensing chip to covering to cover the chip so that the portion of the bond wire protruding above the chip is embedded in the adhesive. A protective plate is attached to the sensing chip by the adhesive and forms an exterior surface of the device.
Abstract translation: 指纹感测装置（及其相关联的制造方法）包括布置在具有读出电路的基板上的感测芯片。 感测芯片包括具有限定感测平面的表面的多个感测元件，每个感测元件被配置为提供指示感测元件和放置在感测装置上的手指之间的电磁耦合的信号; 分别布置在位于基板上的感测芯片上的接合焊盘之间以将感测芯片电连接到读出电路的接合线。 接合线的一部分突出在芯片的上方，并且在感测芯片上布置粘合剂以覆盖以覆盖芯片，使得突出在芯片上方的接合线的部分嵌入粘合剂中。 保护板通过粘合剂附接到感测芯片，并形成设备的外表面。
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12.发明授权Fingerprint sensing device with heterogeneous coating structure comprising an adhesive 有权具有包含粘合剂的异质涂层结构的指纹感测装置公开(公告)号：US09507992B1
公开(公告)日：2016-11-29
申请号：US14997689
申请日：2016-01-18
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl
CPC classification number: G06K9/00053 , G03F7/16 , G06K9/00 , G06K9/0002
Abstract: A fingerprint sensing device comprises a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with an adhesive; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the adhesive is higher than a dielectric constant of the coating material; and a protective plate attached to the sensing chip by means of the adhesive. Another sensing device is disclosed, where the coating layer comprises trenches filled with an adhesive, and where the coating has a higher dielectric constant than the adhesive. Associated methods of manufacturing are also disclosed.
Abstract translation: 指纹感测装置包括感测芯片，其包括电容感测元件阵列。 感测装置包括布置在感测元件阵列的顶部上的涂层材料，涂层材料包括填充有粘合剂的多个空腔; 其中所述腔的位置对应于所述感测元件的位置，使得空腔的横截面面积覆盖相应感测元件的区域的至少一部分; 并且其中所述粘合剂的介电常数高于所述涂层材料的介电常数; 以及通过粘合剂附接到感测芯片的保护板。 公开了另一种感测装置，其中涂层包括填充有粘合剂的沟槽，并且其中涂层具有比粘合剂更高的介电常数。 还公开了相关的制造方法。
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公开(公告)号：US09449214B2
公开(公告)日：2016-09-20
申请号：US14894162
申请日：2014-07-01
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl
CPC classification number: G06K9/00053 , G06K7/08 , G06K9/00006 , G06K9/00013 , G06K9/0002 , G06K9/20 , G06K9/209 , H01L23/26 , H01L23/28 , H01L23/3178 , H01L23/562 , H01L23/564 , H01L2924/0002 , H01L2924/00
Abstract: A sensing device comprising a plurality of sensing elements, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing element and a finger placed on a surface of the sensing device, a first layer arranged to cover the plurality of sensing elements, the first layer comprising a plurality of recesses, and a second layer arranged to cover the first layer, the second layer having hydrophobic surface properties. There is also provided a method for manufacturing such a sensing device.
Abstract translation: 一种感测装置，包括多个感测元件，每个感测元件被配置为提供指示感测元件和放置在感测装置的表面上的手指之间的电磁耦合的信号;布置成覆盖多个感测元件的第一层 感测元件，第一层包括多个凹部，以及布置成覆盖第一层的第二层，第二层具有疏水表面性质。 还提供了一种用于制造这种感测装置的方法。
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公开(公告)号：US20160171271A1
公开(公告)日：2016-06-16
申请号：US14926327
申请日：2015-10-29
Applicant: FINGERPRINT CARDS AB
Inventor： Karl Lundahl
IPC: G06K9/00 , G06F3/0488 , G06F3/044
CPC classification number: G06K9/0002 , G06F3/044 , G06F3/0488 , G06K9/00053 , G06K9/209 , H01L27/14618 , H01L27/14678 , H01L2224/48471
Abstract: A fingerprint sensing device (and associated method of manufacturing) comprises a sensing chip arranged on a substrate with readout circuitry. The sensing chip comprising a plurality of sensing elements having a surface defining a sensing plane, each sensing element being configured to provide a signal indicative of an electromagnetic coupling between a sensing element and a finger placed on the sensing device; bond wires arranged between bond pads located on the sensing chip on the substrate, respectively, to electrically connect the sensing chip to the readout circuitry. A portion of the bond wire protrudes above the chip and an adhesive is arranged on the sensing chip to covering to cover the chip so that the portion of the bond wire protruding above the chip is embedded in the adhesive. A protective plate is attached to the sensing chip by the adhesive and forms an exterior surface of the device.
Abstract translation: 指纹感测装置（及其相关联的制造方法）包括布置在具有读出电路的基板上的感测芯片。 感测芯片包括具有限定感测平面的表面的多个感测元件，每个感测元件被配置为提供指示感测元件和放置在感测装置上的手指之间的电磁耦合的信号; 分别布置在位于基板上的感测芯片上的接合焊盘之间以将感测芯片电连接到读出电路的接合线。 接合线的一部分突出在芯片的上方，并且在感测芯片上布置粘合剂以覆盖以覆盖芯片，使得突出在芯片上方的接合线的部分嵌入粘合剂中。 保护板通过粘合剂附接到感测芯片，并形成设备的外表面。
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15.发明授权公开(公告)号：US11610427B2
公开(公告)日：2023-03-21
申请号：US16645908
申请日：2018-09-17
Applicant: FINGERPRINT CARDS AB
Inventor： Karl Lundahl
IPC: G06V40/13 , B06B1/06 , H01L41/113 , H01L41/047 , H01L41/083 , H01L41/187 , H01L41/22 , H01L41/25 , H01L41/27
Abstract: An ultrasonic transducer device for use in an acoustic biometric imaging system, the ultrasonic transducer device comprising: a first piezoelectric element having a first face, a second face opposite the first face, and side edges extending between the first face and the second face; a first transducer electrode on the first face of the first piezoelectric element; a second transducer electrode on the second face of the first piezoelectric element; and a spacer structure leaving at least a portion of the first transducer electrode of the first piezoelectric element uncovered.
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Patent Agency Ranking
公开(公告)号：US11288487B2
公开(公告)日：2022-03-29
申请号：US16485293
申请日：2018-02-07
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl , Erik Svensson , Morten Rolle Hansen
Abstract: The invention relates to a method of a fingerprint sensing system of enabling cancelling out impairment data present in an image captured by a fingerprint sensor of the fingerprint sensing system, a method of a fingerprint sensing system of cancelling out impairment data present in an image captured by a fingerprint sensor of the fingerprint sensing system, and a fingerprint sensing system performing the methods.
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公开(公告)号：US11036955B2
公开(公告)日：2021-06-15
申请号：US16623443
申请日：2018-08-21
Applicant: Fingerprint Cards AB
Inventor： Hanna Nilsson , Adam Benson , Karl Lundahl
Abstract: A method for manufacturing a fingerprint sensor device. The method comprises providing a fingerprint sensor chip, arranging the fingerprint sensor chip on a carrier, depositing a cover layer on the fingerprint sensor chip, the cover layer comprising a polarizable material; moving a top electrode into contact with a top surface of the cover layer; and applying a voltage between the top electrode and a bottom electrode located below the cover layer and comprised in a material stack between the bottom of the carrier and the cover layer, creating an electric field in the cover layer, thereby poling the cover layer such that a dielectric constant of the cover layer in a direction perpendicular to the sensing array is higher than a dielectric constant in a direction parallel to the sensing array, thereby forming a cover layer having an anisotropic dielectric constant.
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18.发明授权公开(公告)号：US10043049B2
公开(公告)日：2018-08-07
申请号：US15654798
申请日：2017-07-20
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl , Hanna Nilsson
IPC: G06K9/00
Abstract: The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements and comprising a plurality of cavities filled with a dielectric material. The dielectric material comprises reduced graphene oxide. Locations of the cavities correspond to locations of the sensing elements such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element. A dielectric constant of the dielectric material is higher than a dielectric constant of the coating material. The invention also relates to a sensing device where the dielectric coating layer containing reduced graphene oxide comprises trenches corresponding to areas between the sensing pixels filled with a fill material, where the dielectric coating layer has a higher dielectric constant than the fill material.
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公开(公告)号：US09805244B2
公开(公告)日：2017-10-31
申请号：US15613741
申请日：2017-06-05
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl
CPC classification number: G06K9/00053 , G03F7/16 , G06K9/00 , G06K9/0002
Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements defines a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.
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公开(公告)号：US20170270344A1
公开(公告)日：2017-09-21
申请号：US15613741
申请日：2017-06-05
Applicant: Fingerprint Cards AB
Inventor： Karl Lundahl
CPC classification number: G06K9/00053 , G03F7/16 , G06K9/00 , G06K9/0002
Abstract: The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device. A surface of the sensing elements defines a sensing plane. The sensing device further comprises a plurality of interposer structures arranged on the sensing chip extending above sensing plane, wherein the plurality of interposer structures have the same height above the sensing plane. A protective plate is attached to the sensing chip by means of an adhesive, and the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.
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