Composite component void repair
    13.
    发明授权

    公开(公告)号:US11292217B2

    公开(公告)日:2022-04-05

    申请号:US15993845

    申请日:2018-05-31

    Abstract: Methods for repairing composite component voids are provided. For example, one method comprises locating a void in a composite component and subjecting the composite component to a process for repair. The process for repair includes creating a flow path through the void, applying a filler material to the composite component at the flow path, and processing the composite component having the filler material. In some embodiments, the flow path has a first opening on a first side of the composite component and a second opening on a second, opposite side of the composite component. In other embodiments, at least one portion of the flow path extends at a first angle with respect to a lateral direction defined by the CMC component, and at least another portion extends at a second angle with respect to the lateral direction.

    INDUCTION MELT INFILTRATION PROCESSING OF CERAMIC MATRIX COMPOSITE COMPONENTS

    公开(公告)号:US20210261470A1

    公开(公告)日:2021-08-26

    申请号:US16801591

    申请日:2020-02-26

    Abstract: A system and method of melt infiltrating components is provided. In one example aspect, an inductive heating system includes a heating source that inductively heats a susceptor. The susceptor defines a working chamber in which components can be received. During melt infiltration, the system can heat the susceptor and thus the components and melt infiltrants disposed within the working chamber at a first heating rate. The first heating rate can be faster than 50° C./minute. The system can then heat the components and melt infiltrants at a second heating rate. The first heating rate is faster than the second heating rate. Thereafter, the system can heat the components and infiltrants at a third heating rate. The third heating rate can be a constant rate at or above the melting point of the melt infiltrants. The infiltrants can melt and thus infiltrate into the component to densify the component.

Patent Agency Ranking