公开(公告)号：US20200015325A1

公开(公告)日：2020-01-09

申请号：US16427896

申请日：2019-05-31

Applicant: Goodrich Corporation

Inventor： Wenping Zhao ,  Jin Hu ,  Nathaniel Ching ,  George F. Owens ,  Casey Slane ,  Brandon Hein ,  Daniel Waina ,  James A. Mullen ,  Melissa Leigh Patterson ,  Galdemir Cezar Botura

IPC: H05B3/28 ,  H05B3/03 ,  H05B3/06 ,  B64C1/18

Abstract: A heated floor panel assembly contains a positive temperature coefficient heater secured in the assembly through a number of welded joints through a thermoplastic dielectric layer. The positive temperature coefficient heater is on a thermoplastic substrate, which is bonded to the thermoplastic dielectric layer. The assembly further includes an impact layer, a core layer, and structural layers.