HEATED FLOOR PANELS
    10.
    发明申请
    HEATED FLOOR PANELS 审中-公开

    公开(公告)号:US20200011542A1

    公开(公告)日:2020-01-09

    申请号:US16026336

    申请日:2018-07-03

    IPC分类号: F24D13/02 H05B3/14

    摘要: A heater panel includes a core and a heater/dielectric layer including a positive thermal coefficient (PTC) heater layer between a pair of dielectric layers. A structural facing is included, wherein the heater/dielectric layer is bonded directly between the core and the structural facing. A second structural facing can be bonded to the core opposite the heater/dielectric layer. An impact layer can be bonded to the structural facing, e.g., the first structural facing described above, opposite the heater/dielectric layer.