Heat Sink Assembly
    14.
    发明申请
    Heat Sink Assembly 审中-公开

    公开(公告)号:US20180058773A1

    公开(公告)日:2018-03-01

    申请号:US15252213

    申请日:2016-08-31

    Abstract: A heat sink assembly includes plural thermally conductive hair fins configured to be thermally coupled with a component to be cooled. The hair fins are elongated along a first direction and separated from each other by gaps along different second and third directions. The hair fins are configured to receive heat from the component to be cooled and to transfer the heat to cooling air disposed between the hair fins in order to cool the component.

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