公开(公告)号：US20220131365A1

公开(公告)日：2022-04-28

申请号：US17430271

申请日：2020-02-05

Applicant: General Electric Technology GmbH

Inventor： Colin Charnock DAVIDSON ,  Andrew NOLAN ,  Alistair John BURNETT

IPC: H02H7/10 ,  H02J3/36 ,  H02M1/32 ,  H02M7/00 ,  H02H1/00 ,  H02M7/5387

Abstract: An electrical assembly comprises a plurality of modules (36), each module (36) including at least one switching element (38) and at least one energy storage device (40), the or each switching element (38) and the or each energy storage device (40) in each module (36) arranged to be combinable to selectively provide a voltage source, wherein each module (36) includes a respective sensor (46) that is configured to monitor at least one other of the plurality of modules (36), each sensor (46) configured to selectively detect an occurrence of an operational hazard in the or each corresponding monitored module (36).

公开(公告)号：US20200013571A1

公开(公告)日：2020-01-09

申请号：US16470043

申请日：2017-12-11

Applicant: General Electric Technology GmbH

Inventor： Colin Charnock DAVIDSON

IPC: H01H33/59 ,  H01H9/40

Abstract: A switching apparatus comprises a plurality of current-conductive branches connected in parallel between first and second terminals, each current-conductive branch including at least one respective electrical connection member in series connection with at least one respective gas tube switch between the first and second terminals, wherein the inductance value of each electrical connection member is configured to balance the inductance values of the current-conductive branches.

公开(公告)号：US20180374770A1

公开(公告)日：2018-12-27

申请号：US15563033

申请日：2016-03-29

Applicant: General Electric Technology GmbH

Inventor： Colin Charnock DAVIDSON ,  Konstantin VERSHININ

IPC: H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L25/07 ,  H05K1/02 ,  H02M7/00 ,  H05K7/20

Abstract: An electrical assembly including a primary electrical component having a semiconductor device, a primary heat sink having the primary electrical component mounted thereon to provide a heat sink for said primary electrical component, a secondary electrical component electrically connected or coupled with the primary electrical component, a secondary heat sink having the secondary electrical component mounted thereon to provide a heat sink for said secondary electrical component, wherein the primary heat sink and the secondary heat sink are physically releasably couplable to one another and, when coupled, the primary and secondary heat sinks are thermally coupled by abutment of heat transfer surfaces of the primary and secondary heat sinks.