公开(公告)号：US10772186B2

公开(公告)日：2020-09-08

申请号：US15543206

申请日：2015-01-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Adolfo Gomez ,  Tom J. Searby ,  Andrew L. Wiltzius

IPC: H05K1/02 ,  H05K5/03 ,  H05K5/02 ,  B29C51/00 ,  B29C51/26 ,  B29C65/48 ,  B29C65/56 ,  B29K69/00 ,  B29L31/34

Abstract: A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB.

公开(公告)号：US20190227605A1

公开(公告)日：2019-07-25

申请号：US16341051

申请日：2016-10-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Andrew L. Wiltzius ,  Robert J. Ebner

IPC: G06F1/20 ,  G06F13/40 ,  H05K7/20 ,  G06F1/18

Abstract: In an example implementation, an expansion card assembly includes a low-profile expansion card, a card cooler attached to the card to force air over the card, and an airflow guide attachable to the card to direct forced air from the card cooler out of a full-height computer enclosure.