公开(公告)号：US11424526B2

公开(公告)日：2022-08-23

申请号：US16761006

申请日：2017-12-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chin-Hung Ma ,  Chien-Pai Lai ,  Ju-Hung Chen

IPC: H01Q1/36 ,  H01Q1/22 ,  H01Q13/10

Abstract: An example device includes a conductive housing. The conductive housing has a slot containing a dielectric material. An antenna includes a resonating element disposed within the slot. A first connector is disposed within the slot. A second connector is disposed within the slot. The resonating element of the antenna is located between the first connector and the second connector.

公开(公告)号：US20210194128A1

公开(公告)日：2021-06-24

申请号：US16978723

申请日：2018-06-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chin-Hung Ma ,  Chien-Pai Lai ,  Chih Hung Chien

IPC: H01Q5/40 ,  H01Q1/48 ,  H01Q1/24 ,  H01Q13/10 ,  H01Q21/06 ,  H01Q1/22

Abstract: An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.

公开(公告)号：US11721899B2

公开(公告)日：2023-08-08

申请号：US17748835

申请日：2022-05-19

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chin-Hung Ma ,  Chien-Pai Lai ,  Chih Hung Chien

IPC: H01Q21/00 ,  H01Q5/40 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q13/10 ,  H01Q21/06

CPC classification number: H01Q5/40 ,  H01Q1/2258 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/48 ,  H01Q13/10 ,  H01Q21/065

Abstract: An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.

公开(公告)号：US11522290B1

公开(公告)日：2022-12-06

申请号：US17363076

申请日：2021-06-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chin-Hung Ma ,  Ruei-Ting Miau ,  Po Chao Chen ,  Yung-Chang Wei

IPC: H01Q1/22 ,  H01Q9/04

Abstract: In an example, an electronic device may include a housing and a display panel disposed in the housing. Further, the electronic device may include an input assembly disposed in the housing abutting a side of the display panel. The input assembly may include a printed circuit board (PCB), a sensor disposed on the PCB, and a first keep-out zone defined on the PCB on a side of the sensor. Further, the electronic device may include an antenna disposed in the first keep-out zone of the PCB.

公开(公告)号：US20220376377A1

公开(公告)日：2022-11-24

申请号：US17323156

申请日：2021-05-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Pai-Cheng Huang ,  Chin-Hung Ma ,  Po Chao Chen

IPC: H01Q1/22 ,  G06F1/16

Abstract: In one example in accordance with the present disclosure, an electronic device is described. An example electronic device includes an antenna. The example antenna includes a feed point and a first radiator coupled to the feed point. The example antenna also includes a switch coupled to the first radiator and a second radiator coupled to the switch. The example switch (1) disconnects the first radiator from the second radiator when the electronic device is in a first mode; and (2) connects the first radiator to the second radiator when the electronic device is in a second mode.

公开(公告)号：US20220336959A1

公开(公告)日：2022-10-20

申请号：US17641878

申请日：2019-11-01

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Juhung Chen ,  Chin-Hung Ma ,  Po Chao Chen ,  Hung-Wen Cheng

IPC: H01Q13/10 ,  H01Q1/48 ,  H01Q9/42

Abstract: An antenna assembly includes a ground plane, a radiator, and a resonant circuit. The ground plane has a slot with an open end. The radiator spans the slot and has a shape configured to radiate electromagnetic energy at a first frequency and at a second frequency. The resonant circuit spans the slot in parallel with the radiator and is positioned nearer the open end than an opposite end of the slot.

公开(公告)号：US11367957B2

公开(公告)日：2022-06-21

申请号：US16978723

申请日：2018-06-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chin-Hung Ma ,  Chien-Pai Lai ,  Chih Hung Chien

IPC: H01Q21/00 ,  H01Q5/40 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q13/10 ,  H01Q21/06

Abstract: An example radio frequency (RF) front-end module may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.