公开(公告)号：US20210194128A1

公开(公告)日：2021-06-24

申请号：US16978723

申请日：2018-06-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chin-Hung Ma ,  Chien-Pai Lai ,  Chih Hung Chien

IPC: H01Q5/40 ,  H01Q1/48 ,  H01Q1/24 ,  H01Q13/10 ,  H01Q21/06 ,  H01Q1/22

Abstract: An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.

公开(公告)号：US11039403B2

公开(公告)日：2021-06-15

申请号：US16761026

申请日：2018-02-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Cheng Chih Chen ,  Min Hsu Chuang ,  Chih Hung Chien

IPC: H04B17/318 ,  H04W52/34 ,  H04W52/24 ,  H04W88/06

Abstract: In an example, an electronic device includes a first antenna and a second antenna. The electronic device may further include a power modulator to determine a simultaneous operation of the first antenna and the second antenna. The power modulator may monitor a first signal parameter of the first antenna and a second signal parameter of the second antenna. Upon monitoring signal parameters of respective antenna, the power modulator may dynamically regulate a first transmission power of the first antenna and a second transmission power of the second antenna based on the first signal parameter, the second signal parameter, and a threshold transmission value.

公开(公告)号：US11721899B2

公开(公告)日：2023-08-08

申请号：US17748835

申请日：2022-05-19

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chin-Hung Ma ,  Chien-Pai Lai ,  Chih Hung Chien

IPC: H01Q21/00 ,  H01Q5/40 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q13/10 ,  H01Q21/06

CPC classification number: H01Q5/40 ,  H01Q1/2258 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/48 ,  H01Q13/10 ,  H01Q21/065

Abstract: An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.

公开(公告)号：US11367957B2

公开(公告)日：2022-06-21

申请号：US16978723

申请日：2018-06-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chin-Hung Ma ,  Chien-Pai Lai ,  Chih Hung Chien

IPC: H01Q21/00 ,  H01Q5/40 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q13/10 ,  H01Q21/06

Abstract: An example radio frequency (RF) front-end module may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.