公开(公告)号：US20220388248A1

公开(公告)日：2022-12-08

申请号：US17774803

申请日：2019-12-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Gary J Dispoto

IPC: B29C64/393 ,  B33Y10/00 ,  B29C64/141 ,  B33Y50/02 ,  B22F5/00 ,  B22F10/20 ,  B22F10/85

Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a fracture channel controller to determine fracture channels for a three-dimensional (3D) printed object. Portions of the 3D printed object along fracture channels are to be solidified to a lesser degree as compared to non-channel portions of the 3D printed object. The system also includes an additive manufacturing controller to control an additive manufacturing device. The additive manufacturing controller controls the additive manufacturing device to 1) solidify portions of a layer of powdered build material to form a slice of the 3D printed object and 2) selectively solidify fracture channels in the slice, wherein the fracture channels are solidified to a lesser degree as compared to non-channel portions.

公开(公告)号：US20210174594A1

公开(公告)日：2021-06-10

申请号：US17047364

申请日：2018-08-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei Huang ,  Gary J Dispoto

IPC: G06T19/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/393 ,  B22F10/85

Abstract: An example system includes a three-dimensional (3D) printer to produce a 3D working product. The 3D working product includes cured material forming a printed portion of a 3D object and uncured material, and the printed portion of the 3D object is at least partly embedded in the uncured material. The example system further includes a controller to generate a virtualized image of at least a part of the 3D object and a display coupled to the controller, the display to display a virtualized environment, the virtualized environment including the virtualized image of the 3D object, the virtualized image of the 3D object corresponding to at least a part of the printed portion of the 3D object.

公开(公告)号：US20170212788A1

公开(公告)日：2017-07-27

申请号：US15500510

申请日：2014-10-23

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jun Zeng ,  Sushant Bhattacharya ,  Gary J Dispoto ,  Will Allen ,  Patrick O Sandfort ,  Francisco Jose Oblea Ramirez ,  Steven Simske

IPC: G06F9/50 ,  G06F9/48 ,  G06F3/12

CPC classification number: G06F9/505 ,  G06F3/121 ,  G06F3/1231 ,  G06F9/4881 ,  G06F2209/501

Abstract: Examples herein disclose receiving a service request including a latency associated with a publication of a result of the service request. The examples disclose computing a workload for the service request and identifying multiple resources which are to perform the service request by applying the latency to the multiple resources.