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公开(公告)号：US20210313176A1
公开(公告)日：2021-10-07
申请号：US17262766
申请日：2018-11-08
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Robert Ionescu , Helen A. Holder , Jarrid Wittkopf
Abstract: A method may include ejecting, from a nozzle, a first printable ammonium-based chalcogenometalate fluid comprising a first dopant onto a substrate to form a layer of the first printable ammonium-based chalcogenometalate fluid; heating, at a first temperature, the layer of first printable ammonium-based chalcogenometalate fluid to dissipate the first printable ammonium-based chalcogenometalate fluid into a transition metal dichalcogenide having the form MX2 with the first dopant distributed therethrough; ejecting, from the nozzle, a second printable ammonium-based chalcogenometalate fluid comprising a second dopant onto the substrate to form a layer of the second printable ammonium-based chalcogenometalate fluid; and heating, at a second and higher temperature, the layers of first and second printable ammonium-based chalcogenometalate fluid.
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公开(公告)号：US11822995B2
公开(公告)日：2023-11-21
申请号：US17414789
申请日：2019-04-12
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： M. Anthony Lewis , William J. Allen , Douglas Pederson , Jarrid Wittkopf , Kristopher J. Erickson , Robert Ionescu
IPC: G06K7/10 , G06K19/067
CPC classification number: G06K7/10009 , G06K19/0672
Abstract: In one example in accordance with the present disclosure, a system is described. The system includes at least one directional antenna to 1) emit energy waves towards a mass in which an object is disposed and 2) receive reflected signals from a resonator disposed on the object as the mass is moved relative to the directional antenna. The system also includes a controller to, based on received reflected signals, determine a pose of the object within the mass.
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公开(公告)号：US20230296547A1
公开(公告)日：2023-09-21
申请号：US18019703
申请日：2020-08-03
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Jarrid Wittkopf , Eric Luna-Ramirez , Kristopher J. Erickson , James William Stasiak
IPC: G01N27/22
CPC classification number: G01N27/227 , G01N27/223
Abstract: In one example in accordance with the present disclosure, a three-dimensional (3D) printed sensor system is described. The 3D printed sensor system includes a 3D printed object. The 3D printed sensor system also includes a 3D printed sensor on a body of the 3D printed object. The 3D printed sensor includes a dielectric region disposed between electrodes. A capacitance of the dielectric region is indicative of an environmental condition of the 3D printed object. The 3D printed sensor system also includes a controller integrated with the body of the 3D printed object. The controller is to measure a capacitance of the 3D printed sensor.
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公开(公告)号：US20220138374A1
公开(公告)日：2022-05-05
申请号：US17414520
申请日：2019-06-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kristopher J. Erickson , Jarrid Wittkopf , Rafael Ballagas , David Wayne George , Lihua Zhao , William J. Allen
IPC: G06F30/20
Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, a design file for the part. A modifier of the system receives user input modifying the design file and a transmitter transmits the modified design file for production of the part.
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公开(公告)号：US20220097308A1
公开(公告)日：2022-03-31
申请号：US17415079
申请日：2019-06-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kristopher J. Erickson , Jarrid Wittkopf , Rafael Ballagas , David Wayne George , Lihua Zhao , William J. Allen
IPC: B29C64/386 , B33Y50/00 , B33Y10/00 , B33Y30/00
Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device is to embed a storage element into the 3D printed object and a controller is to write data to the embedded storage element that relates to manufacturing conditions of the 3D printed object.
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Patent Agency Ranking
公开(公告)号：US20210189165A1
公开(公告)日：2021-06-24
申请号：US16756862
申请日：2017-10-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Robert Ionescu , Ning Ge , Helen A. Holder , Jarrid Wittkopf
Abstract: In one example in accordance with the present disclosure, a printable ammonium-based chalcogenometalate fluid is described. The fluid includes an ammonium-based chalcogenometalate precursor. The printable ammonium-based chalcogenometalate fluid also includes an aqueous solvent and water. The printable ammonium-based chalcogenometalate fluid is printed onto a substrate. In the presence of heat, the aqueous solvent, water, and ammonium-based chalcogenometalate precursor break down to form a transition metal dichalcogenide having the form MX2.
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公开(公告)号：US20210167118A1
公开(公告)日：2021-06-03
申请号：US17047300
申请日：2018-08-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Ning Ge , Robert Ionescu , Helen A Holder , Jarrid Wittkopf
IPC: H01L27/15 , H01L27/144 , H01L25/065 , H01L25/18
Abstract: A device includes a P-N junction comprising a monolithic N-type semiconductor layer coupled to a monolithic P-type semiconductor layer. The monolithic N-type semiconductor layer includes a first portion and a second portion. The first portion has a first surface and the second portion has a second surface facing away from the first surface. The monolithic P-type semiconductor layer includes a third portion and a fourth portion. The third portion has a third surface and the fourth portion has a fourth surface facing away from the third surface.
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公开(公告)号：US11309349B2
公开(公告)日：2022-04-19
申请号：US17047300
申请日：2018-08-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Ning Ge , Robert Ionescu , Helen A Holder , Jarrid Wittkopf
IPC: H01L27/15 , H01L27/144 , H01L25/065 , H01L25/18
Abstract: A device includes a P-N junction comprising a monolithic N-type semiconductor layer coupled to a monolithic P-type semiconductor layer. The monolithic N-type semiconductor layer includes a first portion and a second portion. The first portion has a first surface and the second portion has a second surface facing away from the first surface. The monolithic P-type semiconductor layer includes a third portion and a fourth portion. The third portion has a third surface and the fourth portion has a fourth surface facing away from the third surface.
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公开(公告)号：US20220101411A1
公开(公告)日：2022-03-31
申请号：US17414507
申请日：2019-06-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kristopher J. Erickson , Jarrid Wittkopf , Rafael Ballagas , David Wayne George , Lihua Zhao , William J, Allen
Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier associated with a part. An extractor of the system extracts, based on the identifier, sensor output data for the part. A transmitter of the system transmits a re-order request for the part based on the sensor output data.
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公开(公告)号：US20220097305A1
公开(公告)日：2022-03-31
申请号：US17414803
申请日：2019-06-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kristopher J. Erickson , Jarrid Wittkopf , Rafael Ballagas , David Wayne George , Lihua Zhao , William J. Allen
IPC: B29C64/379 , B29C64/393 , B33Y40/20 , B33Y10/00 , B33Y50/02 , G06K19/077 , G06K19/07
Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to 1) read an identifier from a three-dimensional (3D) System printed object that includes a storage element and 2) read a location of the 3D printed object within a build material bed. An extractor of the system extracts, based on the identifier, a post processing operation to execute on the 3D printed object. A controller of the system controls a post processing operation based on extracted post processing operation information and the location.
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