公开(公告)号：US10815121B2

公开(公告)日：2020-10-27

申请号：US16099020

申请日：2016-07-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-lam J. Choy ,  Chien-Hua Chen ,  Michael W. Cumbie ,  Devin Alexander Mourey

IPC: H01L23/18 ,  B81B7/00 ,  B81C1/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/29

Abstract: A composite wafer includes a first silicon die with a first top surface; and a polymer substrate with a top surface and a bottom surface. The silicon die is embedded in the polymer substrate such that the top surface of the substrate and the first top surface of the first silicon die are coplanar and the bottom surface of the polymer substrate is planar.