摘要:
A flip chip BGA board is disclosed, in which each of the corners of the board is removed to minimize warpage of the board due to heat applied during the manufacturing process. Embodiments of the invention allow the production of thin boards by preventing warpage of the board, and may provide a board high in reliability since the risk of the chip being separated from the board is reduced.
摘要:
A circuit of duplexing supervisory modules for use in a data transmission system having an optical fiber system, a multiplexer/demultiplexer system, a work station and a personal computer has a primary information collection supervisory circuit connected to the first and second optical fiber systems, for collecting primary information relating to a local site; a secondary information collection supervisory circuit doubly connected to the primary information collection supervisory circuit, for collecting secondary information in dependence upon the first information; and a tertiary information collection supervisory circuit connected to the work station and doubly connected to the secondary information collection supervisory circuit, for collecting tertiary information in dependence upon the secondary information and providing tertiary information to the work station.