公开(公告)号：US10507662B2

公开(公告)日：2019-12-17

申请号：US16125745

申请日：2018-09-09

申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

发明人： Brian J. Keefe ,  Joseph E. Scheffelin ,  James W. Ring ,  Mark A. Devries

IPC分类号： B41J2/17 ,  B41J2/175 ,  B41J2/18 ,  B41J29/38

摘要： A print module may include a printhead die. The printhead die may include a chamber layer having ink chambers and micro-channels formed in the chamber layer. The print module may further include a die carrier including manifold passages through which ink flows to and from the printhead die and dual pressure regulators to flow fluid through the micro-channels of the printhead die.

公开(公告)号：US20190001686A1

公开(公告)日：2019-01-03

申请号：US16125745

申请日：2018-09-09

申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

发明人： Brian J. Keefe ,  Joseph E. Scheffelin ,  James W. Ring ,  Mark A. Devries

IPC分类号： B41J2/17 ,  B41J29/38 ,  B41J2/175 ,  B41J2/18

CPC分类号： B41J2/17 ,  B41J2/175 ,  B41J2/17563 ,  B41J2/17596 ,  B41J2/18 ,  B41J29/38

摘要： A print module may include a printhead die. The printhead die may include a chamber layer having ink chambers and micro-channels formed in the chamber layer. The print module may further include a die carrier including manifold passages through which ink flows to and from the printhead die and dual pressure regulators to flow fluid through the micro-channels of the printhead die.