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11.发明授权Drive apparatus adapted to promote heat dissipation from electronic circuit integrated therein 有权驱动装置适于促进从其中集成的电子电路的散热公开(公告)号：US08304942B2
公开(公告)日：2012-11-06
申请号：US12822396
申请日：2010-06-24
CPC分类号： H02K11/024 , H02K3/522 , H02K11/05 , H02K11/33 , H02K2203/09 , H02K2211/03
摘要： A drive apparatus has a motor device having a tubular motor case. A stator is arranged radially inside the motor case. A rotor is arranged radially inside the stator. A shaft is rotatable with the rotor. An electronic circuit is arranged in the central axis direction of the shaft relative to the motor case. A choke coil has a hole in a central part thereof, in which the shaft is inserted.
摘要翻译： 驱动装置具有具有管状电动机壳体的电动机装置。 电动机壳体内径向配置定子。 转子径向布置在定子内。 轴可随转子旋转。 电子电路相对于电动机壳体设置在轴的中心轴线方向上。 扼流线圈在其中心部分具有孔，其中插入有轴。
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公开(公告)号：US20120098391A1
公开(公告)日：2012-04-26
申请号：US13336492
申请日：2011-12-23
IPC分类号： H02K5/22
CPC分类号： H02K11/0073 , B62D5/0406 , H02K3/50 , H02K5/225 , H02K9/22 , H02K11/33
摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).
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公开(公告)号：US20100327678A1
公开(公告)日：2010-12-30
申请号：US12822396
申请日：2010-06-24
CPC分类号： H02K11/024 , H02K3/522 , H02K11/05 , H02K11/33 , H02K2203/09 , H02K2211/03
摘要： A drive apparatus has a motor device having a tubular motor case. A stator is arranged radially inside the motor case. A rotor is arranged radially inside the stator. A shaft is rotatable with the rotor. An electronic circuit is arranged in the central axis direction of the shaft relative to the motor case. A choke coil has a hole in a central part thereof, in which the shaft is inserted.
摘要翻译： 驱动装置具有具有管状电动机壳体的电动机装置。 电动机壳体内径向配置定子。 转子径向布置在定子内。 轴可随转子旋转。 电子电路相对于电动机壳体设置在轴的中心轴线方向上。 扼流线圈在其中心部分具有孔，其中插入有轴。
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14.发明授权Drive apparatus having a motor, a heat sink, and a plurality of semiconductor modules 有权具有马达，散热器和多个半导体模块的驱动装置公开(公告)号：US09000633B2
公开(公告)日：2015-04-07
申请号：US13379096
申请日：2010-06-23
CPC分类号： H02K11/0073 , B62D5/0406 , H02K5/225 , H02K11/33 , H02K2211/03
摘要： A heat sink has two heat radiation blocks. The heat radiation block is formed in a wide column shape. The heat radiation block has connection parts at both ends. The connection parts have respective holes formed to pass through in the axial direction of a motor. One screw is inserted in one connection part and threaded into a motor case. The other screw is inserted in the other connection part and threaded into the motor case together with a cover. A power module forming an inverter circuit of each of two power supply systems is arranged on each heat radiation blocks.
摘要翻译： 散热片有两个散热块。 散热块形成为宽的柱状。 散热块在两端具有连接部分。 连接部具有形成为沿电动机的轴向通过的各个孔。 一个螺丝插入一个连接部分并拧入电机外壳。 另一个螺钉插入另一个连接部分，并与盖子一起拧入电机外壳。 形成两个电源系统中的每一个的逆变器电路的功率模块布置在每个散热块上。
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公开(公告)号：US08957557B2
公开(公告)日：2015-02-17
申请号：US13380321
申请日：2010-06-23
CPC分类号： H02K11/0073 , B62D5/0406 , H02K3/50 , H02K5/225 , H02K9/22 , H02K11/33
摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).
摘要翻译： 包括半导体模块（501至506）和电容器（701至706）的电子控制单元（50,70）设置在电动机（30）的轴向上。 半导体模块（501至506）被纵向放置并与散热器（601）接触。 包括在半导体模块（501至506）中的半导体芯片的每个表面的垂直线垂直于电动机（30）的轴线。 因此，电容器（701〜706）的配置使得至少一部分电容器（701〜706）在电动机（30）的轴向上与半导体模块（501〜506）和散热片（601）重叠， 。
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公开(公告)号：US20120098366A1
公开(公告)日：2012-04-26
申请号：US13380321
申请日：2010-06-23
IPC分类号： H02K5/00
CPC分类号： H02K11/0073 , B62D5/0406 , H02K3/50 , H02K5/225 , H02K9/22 , H02K11/33
摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).
摘要翻译： 包括半导体模块（501至506）和电容器（701至706）的电子控制单元（50,70）设置在电动机（30）的轴向上。 半导体模块（501至506）被纵向放置并与散热器（601）接触。 包括在半导体模块（501至506）中的半导体芯片的每个表面的垂直线垂直于电动机（30）的轴线。 因此，电容器（701〜706）的配置使得至少一部分电容器（701〜706）在电动机（30）的轴向上与半导体模块（501〜506）和散热片（601）重叠， 。
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公开(公告)号：US09124155B2
公开(公告)日：2015-09-01
申请号：US13380309
申请日：2010-06-23
CPC分类号： H02K9/22 , B62D5/0406 , H02K3/50 , H02K5/225 , H02K11/33
摘要： A heat sink of a drive apparatus includes a heat receiving surface located in a rising direction from an end surface wall of a motor case formed in an axial direction of the motor case. A power module includes a mold part and is arranged along the heat receiving surface of the heat sink. Motor leads are taken out from the motor case and electrically connected to the power module and winding wires. The drive apparatus has the motor case, a control circuit substrate, the heat sink, the power module and a power circuit substrate arranged in this order in the axial direction. The motor leads are connected to the power module at an opposite side of the motor case relative to the mold part in the axial direction.
摘要翻译： 驱动装置的散热器包括从沿电动机壳体的轴向方向形成的电动机壳体的端面壁沿上升方向设置的受热面。 功率模块包括模具部件并且沿着散热器的热接收表面布置。 电机引线从电机外壳中取出并与电源模块和绕组电线电连接。 驱动装置具有马达壳体，控制电路基板，散热器，电源模块和沿轴向依次布置的电源电路基板。 马达引线在轴向方向上相对于模具部件在马达壳体的相对侧连接到功率模块。
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公开(公告)号：US09088195B2
公开(公告)日：2015-07-21
申请号：US13379118
申请日：2010-06-23
CPC分类号： H02K11/0073 , B62D5/0406 , H02K5/225 , H02K11/33 , H02K2211/03
摘要： A heat sink of a drive apparatus includes a heat receiving surface located in a rising direction from an end surface wall of a motor case formed in an axial direction of the motor case. A power module is arranged along the heat receiving surface of the heat sink. A control circuit substrate includes a control circuit for controlling driving of a motor and is electrically connected to the power module. A power circuit substrate is supplied with currents supplied to winding wires, and is electrically connected to the power module. In the drive apparatus, the motor case, the control circuit substrate, the power module and the power wiring part are arranged in this order in an axial direction. The power module is arranged longitudinally relative to the end surface wall in the axial direction of the motor case.
摘要翻译： 驱动装置的散热器包括从沿电动机壳体的轴向方向形成的电动机壳体的端面壁沿上升方向设置的受热面。 功率模块沿着散热器的受热表面布置。 控制电路基板包括用于控制电动机的驱动并与电源模块电连接的控制电路。 向电源电路基板供给提供给绕组线的电流，并且电连接到电源模块。 在驱动装置中，马达壳体，控制电路基板，功率模块和电力布线部分沿轴向依次布置。 功率模块相对于电动机壳体的轴向方向上的端面壁纵向布置。
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公开(公告)号：US08299664B2
公开(公告)日：2012-10-30
申请号：US12822381
申请日：2010-06-24
CPC分类号： H01L23/3107 , H01L25/11 , H01L2924/0002 , H01L2924/13091 , H01L2924/19041 , H02K3/522 , H02K11/024 , H02K11/05 , H02K11/33 , H02K2203/03 , H02K2203/09 , H02K2211/03 , H01L2924/00
摘要： A special terminal may project from an encapsulation body of a semiconductor module and may be engaged with an engaging portion of a motor case to limit a positional deviation of the semiconductor module relative to the motor case. Additionally or alternatively, a module side engaging portion may be formed in the encapsulation body and may be engaged with a case side engaging portion to position the semiconductor module relative to the motor case.
摘要翻译： 特殊的端子可以从半导体模块的封装体突出，并且可以与电动机壳体的接合部分接合，以限制半导体模块相对于电机壳体的位置偏移。 附加地或替代地，模块侧接合部分可以形成在封装主体中并且可以与壳体侧接合部分接合以相对于电动机壳体定位半导体模块。
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公开(公告)号：US20120104886A1
公开(公告)日：2012-05-03
申请号：US13379118
申请日：2010-06-23
CPC分类号： H02K11/0073 , B62D5/0406 , H02K5/225 , H02K11/33 , H02K2211/03
摘要： A heat sink of a drive apparatus includes a heat receiving surface located in a rising direction from an end surface wall of a motor case formed in an axial direction of the motor case. A power module is arranged along the heat receiving surface of the heat sink. A control circuit substrate includes a control circuit for controlling driving of a motor and is electrically connected to the power module. A power circuit substrate is supplied with currents supplied to winding wires, and is electrically connected to the power module. In the drive apparatus, the motor case, the control circuit substrate, the power module and the power wiring part are arranged in this order in an axial direction. The power module is arranged longitudinally relative to the end surface wall in the axial direction of the motor case.
摘要翻译： 驱动装置的散热器包括从沿电动机壳体的轴向方向形成的电动机壳体的端面壁沿上升方向设置的受热面。 功率模块沿着散热器的受热表面布置。 控制电路基板包括用于控制电动机的驱动并与电源模块电连接的控制电路。 向电源电路基板供给提供给绕组线的电流，并且电连接到电源模块。 在驱动装置中，马达壳体，控制电路基板，功率模块和电力布线部分沿轴向依次布置。 功率模块相对于电动机壳体的轴向方向上的端面壁纵向布置。
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