公开(公告)号：US10761133B2

公开(公告)日：2020-09-01

申请号：US16095858

申请日：2016-10-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Runqing Ye ,  Weiqiang Hong ,  Yunfei Wang ,  Taixiang Liu

IPC: G01R31/28 ,  H01L21/66

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

公开(公告)号：US20200273770A1

公开(公告)日：2020-08-27

申请号：US16757012

申请日：2017-10-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianping Fang ,  Yanqin Liao ,  Haohui Long ,  Hui Si

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  G06K9/00

Abstract: A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.

公开(公告)号：US20190319465A1

公开(公告)日：2019-10-17

申请号：US16095848

申请日：2016-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Yanlin Wang ,  Taixiang Liu

IPC: H02J7/00

Abstract: A charging method and a related device are provided. A charge protection apparatus includes a micro control unit (MCU), a current detection circuit, a gating circuit, and an input/output (I/O) interface. The current detection circuit detects an external charging current flowing through a power cable. The current detection circuit transmits the external charging current to the MCU. The MCU transmits the external charging current to a user terminal using the I/O interface,such that the user terminal calculates a current difference between the external charging current and an internal charging current detected by the user terminal, and determines, based on the current difference, whether to generate a circuit control command. The MCU receives the circuit control command from the user terminal, and controls, according to the circuit control command, the gating circuit to be in a closed state or an open state.