公开(公告)号：US11051393B2

公开(公告)日：2021-06-29

申请号：US16807522

申请日：2020-03-03

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhiguo Zhang ,  Yingchun Zhang ,  Haitao Zhen ,  Nanbo Kang

IPC: H05K1/02 ,  H05K5/02 ,  H05K9/00 ,  H05K5/00 ,  H05K7/20

Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.

公开(公告)号：US11016546B2

公开(公告)日：2021-05-25

申请号：US16473838

申请日：2016-12-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wei Li ,  Chunyang Chen ,  Baochun Chen ,  Zhiguo Zhang ,  Quanming Li

IPC: H05K7/20 ,  G06F1/20 ,  F28D20/02 ,  H04M1/02

Abstract: A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.

公开(公告)号：US20210109575A1

公开(公告)日：2021-04-15

申请号：US17130289

申请日：2020-12-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Guo Yang ,  Tao Huang ,  Wenming Shi ,  Teng Long ,  Wei Li ,  Jianliang Wang ,  Zhiguo Zhang

IPC: G06F1/20 ,  G06F1/16

Abstract: A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.

公开(公告)号：US20200150732A1

公开(公告)日：2020-05-14

申请号：US16473838

申请日：2016-12-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wei Li ,  Chunyang Chen ,  Baochun Chen ,  Zhiguo Zhang ,  Quanming Li

IPC: G06F1/20 ,  F28D20/02 ,  H04M1/02 ,  H05K7/20

Abstract: A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.

公开(公告)号：US20180146539A1

公开(公告)日：2018-05-24

申请号：US15578992

申请日：2015-06-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhiguo Zhang ,  Yingchun Zhang ,  Haitao Zhen ,  Nanbo Kang

IPC: H05K1/02 ,  H05K5/00

Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.