公开(公告)号：US20210388849A1

公开(公告)日：2021-12-16

申请号：US17408278

申请日：2021-08-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianliang Wang ,  Liujun Zou ,  Jian Shi ,  Zhiguo Zhang

IPC: F04D29/44 ,  F04D29/42 ,  F04D17/08 ,  G06F1/20

Abstract: A centrifugal fan is disclosed. The centrifugal fan includes a housing, and the housing is configured to accommodate an impeller. The impeller rotates relative to the housing. A flow channel that cooperates with the impeller is disposed in the housing. The flow channel includes a pressurization area. In the pressurization area, a static pressure and a flow velocity of an air flow are gradually increased along a rotation direction of the impeller. However, an air inlet is disposed on the housing, and there is a specific gap between the impeller and the air inlet. As a result, when air flows through the pressurization area, there is a specific amount of leakage through the gap. Therefore, an air baffle ring is disposed in the centrifugal fan provided in this application.

公开(公告)号：US10602603B2

公开(公告)日：2020-03-24

申请号：US15578992

申请日：2015-06-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhiguo Zhang ,  Yingchun Zhang ,  Haitao Zhen ,  Nanbo Kang

IPC: H05K1/02 ,  H05K9/00 ,  H05K5/02 ,  H05K5/00 ,  H05K7/20

Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.

公开(公告)号：US12004320B2

公开(公告)日：2024-06-04

申请号：US17596612

申请日：2020-06-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yang Luo ,  Qi Chen ,  Haitao Zhen ,  Zhiguo Zhang ,  Chao Li

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20336

Abstract: A thermal system includes a system component, a working medium, a second-level thermal component, and a working medium transmission component. The system component includes a first-level thermal component and a working medium driver. The working medium driver is configured to drive the working medium to flow through a primary flow-through structure, a secondary flow-through structure, and a transmission channel in the working medium transmission component, and the thickness of the working medium driver is less than or equal to 5 mm.

公开(公告)号：US11847003B2

公开(公告)日：2023-12-19

申请号：US17130289

申请日：2020-12-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Guo Yang ,  Tao Huang ,  Wenming Shi ,  Teng Long ,  Wei Li ,  Jianliang Wang ,  Zhiguo Zhang

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1681 ,  G06F2200/203

Abstract: A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.

公开(公告)号：US10901472B2

公开(公告)日：2021-01-26

申请号：US16473838

申请日：2016-12-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wei Li ,  Chunyang Chen ,  Baochun Chen ,  Zhiguo Zhang ,  Quanming Li

IPC: H05K7/20 ,  G06F1/20 ,  F28D20/02 ,  H04M1/02

Abstract: A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.

公开(公告)号：US10292253B2

公开(公告)日：2019-05-14

申请号：US15518970

申请日：2014-10-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaoqing Li ,  Jinjing Jiang ,  Zhiguo Zhang ,  Bin Wang

IPC: H05K1/02 ,  C09J9/02 ,  H01L23/367 ,  H05K9/00 ,  H01L23/36 ,  H01L23/42 ,  H01L23/552

Abstract: A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.

公开(公告)号：US20170238410A1

公开(公告)日：2017-08-17

申请号：US15518970

申请日：2014-10-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaoqing Li ,  Jinjing Jiang ,  Zhiguo Zhang ,  Bin Wang

IPC: H05K1/02 ,  H05K9/00 ,  C09J9/02 ,  H01L23/367

CPC classification number: H05K1/0203 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/326 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0212 ,  H05K9/0009 ,  H05K9/0032 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.

公开(公告)号：US11719256B2

公开(公告)日：2023-08-08

申请号：US17408278

申请日：2021-08-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianliang Wang ,  Liujun Zou ,  Jian Shi ,  Zhiguo Zhang

IPC: F01D1/02 ,  F04D29/44 ,  F04D17/16 ,  F04D29/42 ,  G06F1/20

CPC classification number: F04D29/441 ,  F04D17/16 ,  F04D29/4226 ,  G06F1/203

Abstract: A centrifugal fan includes a housing configured to accommodate an impeller. The impeller rotates relative to the housing. A flow channel that cooperates with the impeller is disposed in the housing. The flow channel includes a pressurization area, in which a static pressure and a flow velocity of an air flow are gradually increased along a rotation direction of the impeller. However, an air inlet is disposed on the housing, and there is a specific gap between the impeller and the air inlet. As a result, when air flows through the pressurization area, there is a specific amount of leakage through the gap. Therefore, an air baffle ring is disposed in the centrifugal fan provided in this application.

公开(公告)号：US20220304189A1

公开(公告)日：2022-09-22

申请号：US17596612

申请日：2020-06-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yang Luo ,  Qi Chen ,  Haitao Zhen ,  Zhiguo Zhang ,  Chao Li

IPC: H05K7/20

Abstract: A thermal system includes a system component, a working medium, a second-level thermal component, and a working medium transmission component. The system component includes a first-level thermal component and a working medium driver. The working medium driver is configured to drive the working medium to flow through a primary flow-through structure, a secondary flow-through structure, and a transmission channel in the working medium transmission component, and the thickness of the working medium driver is less than or equal to 5 mm.

公开(公告)号：US11272639B2

公开(公告)日：2022-03-08

申请号：US16462826

申请日：2017-02-07

Applicant: Huawei Technologies Co., Ltd.

Inventor： Guo Yang ,  Quanming Li ,  Xiaohu Liu ,  Wei Li ,  Zhiguo Zhang

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

Abstract: A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.