公开(公告)号：US20170184584A1

公开(公告)日：2017-06-29

申请号：US14983568

申请日：2015-12-30

Applicant: Industrial Technology Research Institute

Inventor： Ding-Zheng Lin ,  Feng-Sheng Kao ,  Ting-Yu Shih ,  Ping-Chen Chen ,  Jen-You Chu

IPC: G01N33/543

CPC classification number: G01N33/54393 ,  G01N33/54353 ,  G01N33/54373 ,  G01N33/553

Abstract: A sensing chip including a substrate, a plurality of metal nanostructures, a first surface modified layer and a second surface modified layer is provided. The metal nanostructures are disposed on the substrate. The first surface modified layer is disposed on a surface of the metal nanostructures, wherein the first surface modified layer includes a plurality of thiol group-containing molecules. The second surface modified layer is disposed on a surface of the substrate, wherein the second surface modified layer includes a plurality of silyl group-containing molecules.

公开(公告)号：US10830926B2

公开(公告)日：2020-11-10

申请号：US16681923

申请日：2019-11-13

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ding-Zheng Lin ,  Yu-Ling Hsu ,  Yaw-Ting Wu ,  Ping-Chen Chen

IPC: G06K9/00 ,  G02B3/00

Abstract: A biometric device includes an illuminating unit and an imaging module. The imaging module includes an optical angular selective structure and a sensing layer. The light selecting structure includes a micro lens array, a refractive layer and a light shielding layer. The refractive layer is disposed between the micro lens array and the light shielding layer. The micro lens array includes a plurality of lens unit units, and the light shielding layer has a plurality of light passing portions. The sensing layer defines multiple sensing regions which are spaced apart from each other. The light shielding layer is disposed between the refractive layer and the sensing layer. The sensing regions correspond to the light passing portions, respectively. An optical angular selective distance is defined between the light shielding layer and the sensing layer.

公开(公告)号：US10012646B2

公开(公告)日：2018-07-03

申请号：US14983568

申请日：2015-12-30

Applicant: Industrial Technology Research Institute

Inventor： Ding-Zheng Lin ,  Feng-Sheng Kao ,  Ting-Yu Shih ,  Ping-Chen Chen ,  Jen-You Chu

IPC: G01N21/75 ,  G01N33/543 ,  G01N33/553

CPC classification number: G01N33/54393 ,  G01N33/54353 ,  G01N33/54373 ,  G01N33/553

Abstract: A sensing chip including a substrate, a plurality of metal nanostructures, a first surface modified layer and a second surface modified layer is provided. The metal nanostructures are disposed on the substrate. The first surface modified layer is disposed on a surface of the metal nanostructures, wherein the first surface modified layer includes a plurality of thiol group-containing molecules. The second surface modified layer is disposed on a surface of the substrate, wherein the second surface modified layer includes a plurality of silyl group-containing molecules.