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11.发明授权公开(公告)号：US09843850B2
公开(公告)日：2017-12-12
申请号：US14866850
申请日：2015-09-26
Applicant: Intel Corporation
Inventor： Devon Worrell , David A. Rittenhouse
CPC classification number: H04R1/026 , H04R1/023 , H04R1/025 , H04R1/2807 , H04R1/2826 , H04R1/2896 , H04R7/02 , H04R7/14 , H04R7/20 , H04R9/06 , H04R9/063 , H04R31/006 , H04R2201/021 , H04R2400/11 , H04R2499/11 , H04R2499/13 , H04R2499/15
Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
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公开(公告)号：US09794660B2
公开(公告)日：2017-10-17
申请号：US14866468
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： David A. Rittenhouse
CPC classification number: H04R1/02 , H04R5/04 , H04R2205/021 , H04R2499/11 , H04R2499/15
Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.
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公开(公告)号：US20180270553A1
公开(公告)日：2018-09-20
申请号：US15717684
申请日：2017-09-27
Applicant: Intel Corporation
Inventor： David A. Rittenhouse
Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.
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14.发明授权公开(公告)号：US09888306B2
公开(公告)日：2018-02-06
申请号：US15605946
申请日：2017-05-25
Applicant: INTEL CORPORATION
Inventor： Devon Worrell , David A. Rittenhouse
CPC classification number: H04R1/026 , H04R1/023 , H04R1/025 , H04R1/2807 , H04R1/2826 , H04R1/2896 , H04R7/02 , H04R7/14 , H04R7/20 , H04R9/06 , H04R9/063 , H04R31/006 , H04R2201/021 , H04R2400/11 , H04R2499/11 , H04R2499/13 , H04R2499/15
Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
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15.发明申请公开(公告)号：US20170094382A1
公开(公告)日：2017-03-30
申请号：US14866850
申请日：2015-09-26
Applicant: Intel Corporation
Inventor： Devon Worrell , David A. Rittenhouse
CPC classification number: H04R1/026 , H04R1/023 , H04R1/025 , H04R1/2807 , H04R1/2826 , H04R1/2896 , H04R7/02 , H04R7/14 , H04R7/20 , H04R9/06 , H04R9/063 , H04R31/006 , H04R2201/021 , H04R2400/11 , H04R2499/11 , H04R2499/13 , H04R2499/15
Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
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Patent Agency Ranking
公开(公告)号：US20160010375A1
公开(公告)日：2016-01-14
申请号：US14796832
申请日：2015-07-10
Applicant: Intel Corporation
Inventor： David A. Rittenhouse
CPC classification number: G06F1/1683 , E05Y2900/606 , G06F1/1618 , G06F1/1681
Abstract: Embodiments are generally directed an adjustable tension wrap end hinge. A hinge assembly includes a first wrap end component and a second wrap end component; a first axle and a second axle, the wrap section of the first wrap end component being wrapped at least in part around a first portion of the first axle adjacent to a first end of the first axle, and the wrap section of the second wrap end component being wrapped at least in part around a first portion of the second axle adjacent to a first end of the second axle; and a first tension screw to adjust a tension of the first wrap end component on the first axle and a second tension screw to adjust a tension of the second wrap end component on the second axle.
Abstract translation: 实施例通常涉及可调节的张力包裹端铰链。 铰链组件包括第一包裹端部部件和第二包裹端部部件; 第一轴和第二轴，第一包裹端部件的包裹部分至少部分地围绕与第一轴的第一端相邻的第一轴的第一部分包围，并且第二包裹端的包裹部分 所述部件至少部分地围绕所述第二轴的与所述第二轴的第一端相邻的第一部分; 以及用于调节第一轴上的第一包裹端部部件的张力的第一张紧螺丝和用于调节第二轮轴上的第二卷绕端部部件的张力的第二张紧螺丝。
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17.发明授权公开(公告)号：US11006195B2
公开(公告)日：2021-05-11
申请号：US15605951
申请日：2017-05-26
Applicant: INTEL CORPORATION
Inventor： Devon Worrell , David A. Rittenhouse
Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
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公开(公告)号：US10419834B2
公开(公告)日：2019-09-17
申请号：US15717684
申请日：2017-09-27
Applicant: Intel Corporation
Inventor： David A. Rittenhouse
Abstract: Embodiments are generally directed to an integrated sound bar hinge assembly for a mobile electronic device. A wearable electronic device may include a hinge assembly body; at least one hinge set coupled with hinge assembly body to hingeably couple a first portion of a mobile device to a second portion of the mobile device; and at least one speaker bracket contained in the hinge assembly body to install a first speaker.
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19.发明申请公开(公告)号：US20170359640A1
公开(公告)日：2017-12-14
申请号：US15605951
申请日：2017-05-26
Applicant: INTEL CORPORATION
Inventor： Devon Worrell , David A. Rittenhouse
CPC classification number: H04R1/026 , H04R1/023 , H04R1/025 , H04R1/2807 , H04R1/2826 , H04R1/2896 , H04R7/02 , H04R7/14 , H04R7/20 , H04R9/06 , H04R9/063 , H04R31/006 , H04R2201/021 , H04R2400/11 , H04R2499/11 , H04R2499/13 , H04R2499/15
Abstract: Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
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公开(公告)号：US20170177026A1
公开(公告)日：2017-06-22
申请号：US14978695
申请日：2015-12-22
Applicant: Intel Corporation
Inventor： David A. Rittenhouse
CPC classification number: G06F1/1616 , E05D3/12 , E05D5/14 , E05D11/082 , E05D2005/145 , G06F1/1681 , Y10T16/547
Abstract: Particular embodiments described herein provide for an device that includes a first body coupled to a first housing, a second body coupled to a second housing, a hinge rod, and a spring clip on an outside diameter of the hinge rod, where the spring clip is configured to increase the torque of the hinge.
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