公开(公告)号：US20250071938A1

公开(公告)日：2025-02-27

申请号：US18897955

申请日：2024-09-26

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Olaotan ELENITOBA-JOHNSON ,  Craig JAHNE ,  Phil GENG

IPC: H05K7/20

Abstract: Examples described herein relate to a cold plate. An example apparatus includes a first layer with one or more channels to receive fluid. The example apparatus further includes a second layer that is more rigid than the first layer. The second layer is to be mounted to the first layer and separated from the first layer by a gasket to reduce corrosion of the second layer.

公开(公告)号：US20210410328A1

公开(公告)日：2021-12-30

申请号：US17473896

申请日：2021-09-13

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a cold plate having fluidic channels within the cold plate. The fluidic channels have protective material thereon such that when liquid coolant flows through the fluidic channels the protective material is between the liquid coolant and the cold plate's material, wherein, the protective material is to prevent reaction between the liquid coolant and the cold plate's material.