公开(公告)号：US20220210950A1

公开(公告)日：2022-06-30

申请号：US17697894

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA

IPC: H05K7/20 ,  H01L23/40

Abstract: A molded ceramic layer of a multilayer cooling assembly back plate is described. The molded ceramic layer has an opening on a side of the molded ceramic layer that is to face a back side of a circuit board. The opening is aligned with a location of a back side component on the back side of the circuit board.

公开(公告)号：US20210105911A1

公开(公告)日：2021-04-08

申请号：US17123760

申请日：2020-12-16

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Olaotan ELENITOBA-JOHNSON ,  Craig JAHNE ,  Phil GENG

IPC: H05K7/20

Abstract: Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

公开(公告)号：US20240096741A1

公开(公告)日：2024-03-21

申请号：US18520425

申请日：2023-11-27

Applicant: Intel Corporation

Inventor： Phil GENG ,  David SHIA ,  Ralph V. MIELE ,  Guixiang TAN ,  Jimmy CHUANG ,  Sandeep AHUJA ,  Sanjoy K. SAHA ,  Jeffory L. SMALLEY ,  Mark E. SPRENGER

IPC: H01L23/427

CPC classification number: H01L23/427

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.

公开(公告)号：US20220117080A1

公开(公告)日：2022-04-14

申请号：US17555340

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY ,  Casey WINKEL

IPC: H05K1/02 ,  H01L23/40 ,  H05K1/18

Abstract: An apparatus is described. The apparatus includes a ball grid array (BGA) chip package cooling assembly includes a back plate and a bolster plate. The bolster plate has frame arms. The BGA chip package is to be placed in a window formed by the frame arms and soldered to a region of a printed circuit board. The frame arms surround the region. The printed circuit board is to be subjected to a compressive force between the back plate and the bolster plate.

公开(公告)号：US20210410317A1

公开(公告)日：2021-12-30

申请号：US17474974

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY ,  Eric W. BUDDRIUS ,  Sean T. SIVAPALAN ,  Olaotan ELENITOBA-JOHNSON ,  Mengqi LIU

IPC: H05K7/14 ,  H01L23/053 ,  H01L23/40 ,  H01L23/32

Abstract: An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

公开(公告)号：US20210043537A1

公开(公告)日：2021-02-11

申请号：US16986122

申请日：2020-08-05

Applicant: Intel Corporation

Inventor： Barrett M. FANEUF ,  Phil GENG ,  Kenan ARIK ,  David SHIA ,  Casey WINKEL ,  Sandeep AHUJA ,  Eric D. MCAFEE ,  Jeffory L. SMALLEY ,  Minh T.D. LE ,  Ralph V. MIELE ,  Marc MILOBINSKI ,  Aaron P. ANDERSON ,  Brendan T. PAVELEK

IPC: H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

公开(公告)号：US20220117079A1

公开(公告)日：2022-04-14

申请号：US17555250

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Jeffory L. SMALLEY ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/18

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.

公开(公告)号：US20210410329A1

公开(公告)日：2021-12-30

申请号：US17475026

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Mengqi LIU ,  Phil GENG ,  Ralph V. MIELE ,  Sandeep AHUJA ,  David SHIA

IPC: H05K7/20 ,  H01L23/367

Abstract: An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

公开(公告)号：US20210328370A1

公开(公告)日：2021-10-21

申请号：US17326148

申请日：2021-05-20

Applicant: Intel Corporation

Inventor： Phil GENG ,  Xiang LI ,  George VERGIS ,  Konika GANGULY

IPC: H01R12/70 ,  H01R43/26 ,  H05K1/02

Abstract: An apparatus is described. The apparatus includes a module having a connector along a center axis of the module. The module further includes a first set of semiconductor chips disposed in a first region of the module that resides between a first edge of the module and a first side of the connector, and, a second set of semiconductor chips disposed in a second region of the module that resides between a second opposite edge of the module and a second opposite side of the connector. A through hole does not exist between the first set of semiconductor chips and the first side of the connector nor between the second set of semiconductor chips and the second side of the connector. The module further includes a first through hole between a third edge of the connector and a third edge of the module and a second through hole between a fourth edge of the connector and a fourth edge of the module. The first and second through holes are to align with first and second studs that are to support a leaf spring when the leaf spring is bowed to press the connector into a printed circuit board.

公开(公告)号：US20200327912A1

公开(公告)日：2020-10-15

申请号：US16911168

申请日：2020-06-24

Applicant: Intel Corporation

Inventor： Xiang LI ,  Phil GENG ,  George VERGIS ,  Mani PRAKASH

IPC: G11C5/04 ,  H05K1/18 ,  H05K3/34 ,  G06F1/18 ,  H05K3/40

Abstract: A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.