公开(公告)号：US20210410317A1

公开(公告)日：2021-12-30

申请号：US17474974

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY ,  Eric W. BUDDRIUS ,  Sean T. SIVAPALAN ,  Olaotan ELENITOBA-JOHNSON ,  Mengqi LIU

IPC: H05K7/14 ,  H01L23/053 ,  H01L23/40 ,  H01L23/32

Abstract: An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

公开(公告)号：US20210105911A1

公开(公告)日：2021-04-08

申请号：US17123760

申请日：2020-12-16

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Olaotan ELENITOBA-JOHNSON ,  Craig JAHNE ,  Phil GENG

IPC: H05K7/20

Abstract: Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

公开(公告)号：US20220208645A1

公开(公告)日：2022-06-30

申请号：US17696694

申请日：2022-03-16

Applicant: Intel Corporation

Inventor： Olaotan ELENITOBA-JOHNSON ,  Eric ERIKE ,  Jeffory L. SMALLEY ,  Ulises ENCARNACION ,  Ralph V. MIELE ,  Phil GENG ,  Sri Priyanka TUNUGUNTLA ,  Shaun G. IMMEKER

IPC: H01L23/40

Abstract: An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

公开(公告)号：US20250071938A1

公开(公告)日：2025-02-27

申请号：US18897955

申请日：2024-09-26

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Olaotan ELENITOBA-JOHNSON ,  Craig JAHNE ,  Phil GENG

IPC: H05K7/20

Abstract: Examples described herein relate to a cold plate. An example apparatus includes a first layer with one or more channels to receive fluid. The example apparatus further includes a second layer that is more rigid than the first layer. The second layer is to be mounted to the first layer and separated from the first layer by a gasket to reduce corrosion of the second layer.