公开(公告)号：US20240072419A1

公开(公告)日：2024-02-29

申请号：US18504376

申请日：2023-11-08

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/243 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01Q1/38

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US20210344116A1

公开(公告)日：2021-11-04

申请号：US17373926

申请日：2021-07-13

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US20250158269A1

公开(公告)日：2025-05-15

申请号：US19027041

申请日：2025-01-17

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q9/04

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US20230035608A1

公开(公告)日：2023-02-02

申请号：US17938768

申请日：2022-10-07

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q21/06 ,  H01L23/66

Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.

公开(公告)号：US11509037B2

公开(公告)日：2022-11-22

申请号：US15991295

申请日：2018-05-29

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q21/06 ,  H01L23/66

Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.

公开(公告)号：US11121468B2

公开(公告)日：2021-09-14

申请号：US17014081

申请日：2020-09-08

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08 ,  H01Q11/14

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US10797394B2

公开(公告)日：2020-10-06

申请号：US16000795

申请日：2018-06-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08 ,  H01Q11/14

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.