Semiconductor device and method of manufacturing the same
    14.
    发明申请
    Semiconductor device and method of manufacturing the same 审中-公开
    半导体装置及其制造方法

    公开(公告)号:US20080308876A1

    公开(公告)日:2008-12-18

    申请号:US12155969

    申请日:2008-06-12

    IPC分类号: H01L27/092 H01L21/8238

    摘要: A semiconductor device includes a first gate structure on a first region of a substrate, the first gate structure including sequentially formed a first insulating layer pattern, a first conductive layer pattern, and a first polysilicon layer pattern doped with first impurities of a first conductivity type, a first source/drain in the first region of the substrate doped with second impurities of a second conductivity type, a second gate structure on a second region of the substrate, the second gate structure including sequentially formed a second insulating layer pattern, a second conductive layer pattern, and a second polysilicon layer pattern doped with third impurities with the first conductivity type, and a second source/drain in the second region of the substrate doped with fourth impurities having a conductivity type opposite the second conductivity.

    摘要翻译: 半导体器件包括在衬底的第一区域上的第一栅极结构,第一栅极结构包括顺序地形成第一绝缘层图案,第一导电层图案和掺杂有第一导电类型的第一杂质的第一多晶硅层图案 掺杂有第二导电类型的第二杂质的衬底的第一区域中的第一源极/漏极,在衬底的第二区域上的第二栅极结构,第二栅极结构依次形成第二绝缘层图案,第二栅极结构 导电层图案和掺杂有第一导电类型的第三杂质的第二多晶硅层图案,以及掺杂有具有与第二导电性相反的导电类型的第四杂质的第二基底的第二源极/漏极。