公开(公告)号：US20190356098A1

公开(公告)日：2019-11-21

申请号：US16411950

申请日：2019-05-14

Applicant: Infineon Technologies AG

Inventor： Florian Eacock ,  Guido Strotmann ,  Alparslan Takkac

IPC: H01R43/02 ,  H01L23/00 ,  H05K3/32 ,  B23K20/10

Abstract: One aspect relates to a method that includes bonding an electrically conductive element to a bonding surface of a bonding partner by increasing a temperature of a bonding section of the electrically conductive element from an initial temperature to an increased temperature by passing an electric heating current through the bonding section, and pressing the bonding section with a pressing force against the bonding surface using a sonotrode and introducing an ultrasonic vibration into the bonding section via the sonotrode such that the increased temperature of the bonding section, the ultrasonic signal in the bonding section and the pressing force are simultaneously present and cause the formation of a tight and direct bond between the bonding section and the bonding surface.