公开(公告)号：US20210111164A1

公开(公告)日：2021-04-15

申请号：US17026325

申请日：2020-09-21

Applicant: Innolux Corporation

Inventor： Yi-An Chen ,  Kuan-Hung Kuo ,  Tsau-Hua Hsieh ,  Kai Cheng ,  Wan-Ling Huang

IPC: H01L25/13 ,  H01L33/56

Abstract: The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.