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    ELECTRONIC DEVICE
    1.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240321844A1

    公开(公告)日：2024-09-26

    申请号：US18679375

    申请日：2024-05-30

    申请人： Innolux Corporation

    发明人： Yi-An Chen ,  Kuan-Hung Kuo ,  Tsau-Hua Hsieh ,  Kai Cheng ,  Wan-Ling Huang

    IPC分类号： H01L25/13 ,  H01L33/56

    CPC分类号： H01L25/13 ,  H01L33/56 ,  H01L2933/005

    摘要： An electronic device including a first substrate body, a plurality of light-emitting diodes, a second substrate body, a first polymer element, and a second polymer element is provided. The first substrate body has a light-emitting region and a non-light-emitting region adjacent to the light-emitting region. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate body is disposed opposite to the first substrate body. The first polymer element is disposed between the plurality of light-emitting diodes and the second substrate body, and disposed in the light-emitting region. The second polymer element is disposed between the first substrate body and the second substrate body, and disposed in the non-light-emitting region. There is a distance between a top surface of the second polymer element and a bottom surface of the second substrate body, and the distance is greater than 0.

    Electronic device and method of manufacturing electronic device
    2.
    发明授权
    Electronic device and method of manufacturing electronic device 有权

    公开(公告)号：US12027506B2

    公开(公告)日：2024-07-02

    申请号：US18149661

    申请日：2023-01-03

    申请人： Innolux Corporation

    发明人： Yi-An Chen ,  Kuan-Hung Kuo ,  Tsau-Hua Hsieh ,  Kai Cheng ,  Wan-Ling Huang

    IPC分类号： H01L33/56 ,  H01L25/13

    CPC分类号： H01L25/13 ,  H01L33/56 ,  H01L2933/005

    摘要： The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting diodes, a second substrate, a transparent material layer, and a sealing material. The first substrate comprises a first substrate body. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate is disposed opposite to the first substrate, and comprises a second substrate body. The transparent material layer is disposed between the first substrate and the second substrate. The sealing material is disposed between the first substrate and the second substrate and surrounds the transparent material layer. A distance between a bottom surface of the sealing material and a top surface of the first substrate body is less than a distance between a top surface of the sealing material and a bottom surface of the second substrate body.

    Electronic device and method of manufacturing electronic device
    5.
    发明授权
    Electronic device and method of manufacturing electronic device 有权

    公开(公告)号：US11574897B2

    公开(公告)日：2023-02-07

    申请号：US17026325

    申请日：2020-09-21

    申请人： Innolux Corporation

    发明人： Yi-An Chen ,  Kuan-Hung Kuo ,  Tsau-Hua Hsieh ,  Kai Cheng ,  Wan-Ling Huang

    IPC分类号： H01L29/18 ,  H01L25/13 ,  H01L33/56

    摘要： The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.

    Methods for manufacturing semiconductor device
    6.
    发明授权
    Methods for manufacturing semiconductor device 有权

    公开(公告)号：US11335827B2

    公开(公告)日：2022-05-17

    申请号：US16858826

    申请日：2020-04-27

    申请人： InnoLux Corporation

    发明人： Kai Cheng ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Tung-Kai Liu ,  Hui-Chieh Wang ,  Chun-Hsien Lin ,  Jui-Feng Ko

    IPC分类号： H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/32

    摘要： A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
    7.
    发明申请
    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE 有权

    公开(公告)号：US20210111164A1

    公开(公告)日：2021-04-15

    申请号：US17026325

    申请日：2020-09-21

    申请人： Innolux Corporation

    发明人： Yi-An Chen ,  Kuan-Hung Kuo ,  Tsau-Hua Hsieh ,  Kai Cheng ,  Wan-Ling Huang

    IPC分类号： H01L25/13 ,  H01L33/56

    摘要： The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.

    MANUFACTURING METHOD OF ELECTRONIC DEVICE
    9.
    发明公开
    MANUFACTURING METHOD OF ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240153924A1

    公开(公告)日：2024-05-09

    申请号：US18376002

    申请日：2023-10-03

    申请人： InnoLux Corporation

    发明人： Fang-Ying Lin ,  Kai Cheng ,  Ming-Chang Lin ,  Tsau-Hua Hsieh

    IPC分类号： H01L25/075 ,  G09G3/00

    CPC分类号： H01L25/0753 ,  G09G3/006 ,  G09G2330/08 ,  G09G2330/12 ,  H01L2933/0066

    摘要： A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes a plurality of first recesses and a plurality of second recesses; disposing a plurality of first electronic units in the plurality of first recesses of the plurality of working areas through fluid transfer; identifying a defective working area from the plurality of working areas, wherein at least one of the plurality of first recesses of the defective working area has no electronic unit or a defective first electronic unit disposed therein; and disposing at least one repairing electronic unit in at least one of the plurality of second recesses of the defective working area through laser transfer.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    10.
    发明公开
    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240096857A1

    公开(公告)日：2024-03-21

    申请号：US18527381

    申请日：2023-12-04

    申请人： Innolux Corporation

    发明人： Jian-Jung Shih ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Kai Cheng

    IPC分类号： H01L25/075 ,  H01L21/66 ,  H01L25/16

    CPC分类号： H01L25/0753 ,  H01L22/22 ,  H01L25/167

    摘要： An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.