公开(公告)号：US20190220003A1

公开(公告)日：2019-07-18

申请号：US16366120

申请日：2019-03-27

Applicant: Intel Corporation

Inventor： Sridhar G. Sharma ,  S M Iftekharul Alam ,  Nilesh Ahuja ,  Avinash Kumar ,  Jason Martin ,  Ignacio J. Alvarez

IPC: G05D1/00 ,  H04W4/46 ,  G06N7/00 ,  G06K9/62 ,  G06K9/00

CPC classification number: G05D1/0044 ,  G06K9/00805 ,  G06K9/00818 ,  G06K9/6256 ,  G06K9/6277 ,  G06N7/005 ,  H04W4/46

Abstract: Disclosures herein may be directed to a method, technique, or apparatus directed to a CA/AD that includes a system controller, disposed in a first CA/AD vehicle, to manage a collaborative three-dimensional (3-D) map of an environment around the first CA/AD vehicle, wherein the system controller is to receive, from another CA/AD vehicle proximate to the first CA/AD vehicle, an indication of at least a portion of another 3-D map of another environment around both the first CA/AD vehicle and the other CA/AD vehicle and incorporate the at least the portion of the 3-D map proximate to the first CA/AD vehicle and the other CA/AD vehicle into the 3-D map of the environment of the first CA/AD vehicle managed by the system controller.

公开(公告)号：US20190043220A1

公开(公告)日：2019-02-07

申请号：US15858063

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Avinash Kumar ,  Manjula Gururaj ,  Ramkumar Narayanswamy

IPC: G06T7/80 ,  G06T7/11 ,  G06T7/174 ,  G06T7/73 ,  G06T7/60 ,  H04N5/247 ,  G06T7/38

Abstract: An embodiment of a semiconductor package apparatus may include technology to capture two or more concurrent images of a scene with two or more cameras, detect a feature in a first image from a first camera of the two or more cameras, match the feature in a second image from a second camera of the two or more cameras, and perform a photometric calibration between the first camera and the second camera based on a portion of the first image corresponding to the detected feature and a portion of the second image corresponding to the matched feature. Other embodiments are disclosed and claimed.