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    Microelectronic package having electromagnetic interference shielding
    12.
    发明授权
    Microelectronic package having electromagnetic interference shielding 有权

    公开(公告)号：US11189574B2

    公开(公告)日：2021-11-30

    申请号：US16606628

    申请日：2017-05-31

    Applicant: Intel Corporation

    Inventor： Li-Sheng Weng ,  Chung-Hao Chen ,  James C. Matayabas, Jr. ,  Min Keen Tang

    IPC: H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H05K9/00

    Abstract: A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.

    Integrated circuit package including floating package stiffener
    13.
    发明授权
    Integrated circuit package including floating package stiffener 有权

    公开(公告)号：US09900976B1

    公开(公告)日：2018-02-20

    申请号：US15376469

    申请日：2016-12-12

    Applicant: Intel Corporation

    Inventor： Chung-Hao Chen ,  Min Keen Tang ,  Li-Sheng Weng

    IPC: H05K9/00 ,  H05K1/02 ,  G06F1/16

    CPC classification number: H05K1/0216 ,  G06F1/1698 ,  H05K1/0243 ,  H05K3/0061

    Abstract: Apparatus and method to provide integrated circuit (IC) package integrity without adverse performance degradation are disclosed herein. In some embodiments, an apparatus may include one or more integrated circuits (ICs); a metallic structure that encircles the one or more ICs without being in contact with the one or more ICs, wherein the metallic structure is without an electrical ground; and a conductive epoxy layer disposed below and in contact with the metallic structure, wherein the conductive epoxy is to reduce an electromagnetic field induced by the metallic structure in response to a presence of a wireless signal that operates at approximately a resonant frequency associated with the metallic structure.

    DEVICE, SYSTEM AND METHOD TO MITIGATE LOSS OF SIGNAL INTEGRITY IN A COMMUNICATION OF IMAGE INFORMATION
    14.
    发明申请
    DEVICE, SYSTEM AND METHOD TO MITIGATE LOSS OF SIGNAL INTEGRITY IN A COMMUNICATION OF IMAGE INFORMATION 审中-公开

    公开(公告)号：US20170289410A1

    公开(公告)日：2017-10-05

    申请号：US15085926

    申请日：2016-03-30

    Applicant: Intel Corporation

    Inventor： Mohd Muhaiyiddin Bin Abdullah ,  Chee Kit Chew ,  Chung-Hao Chen

    IPC: H04N5/213 ,  G06T5/20

    CPC classification number: H04N5/213 ,  G06T5/20 ,  H01P1/20

    Abstract: Techniques and mechanisms for exchanging image data via a three-wire data channel of an interconnect, at least a portion of which is disposed in or on a substrate of a printed circuit board. In an embodiment, three data signals are concurrently exchanged in parallel, each via a different respective trace portion of the data channel. The substrate has disposed therein or thereon three filter structures each to perform filtering of a different respective one of the three signals. The filter structures each include a respective sequence of corrugations to increase a stray capacitance provided by a substrate material. In another embodiment, the interconnect is compatible with a Mobile Industry Processor Interface (MIPI) camera physical layer interface (C-PHY) standard.

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