公开(公告)号：US20180234673A1

公开(公告)日：2018-08-16

申请号：US15805598

申请日：2017-11-07

Applicant: Intel Corporation

Inventor： Aviad Zabatani ,  Sagy Bareket ,  Ohad Menashe ,  Erez Sperling ,  Alex Bronstein ,  Michael Bronstein ,  Ron Kimmel ,  Vitaly Surazhsky

IPC: H04N13/246 ,  H04N13/254

CPC classification number: H04N13/246 ,  G06F3/012 ,  G06F3/017 ,  G06F3/0488 ,  G06T5/006 ,  G06T7/85 ,  H04N13/243 ,  H04N13/25 ,  H04N13/254 ,  H04N2013/0081

Abstract: A method and apparatus for performing temperature compensation for thermal distortions in a camera system. In one embodiment, the system comprises a first camera configured to capture a sequence of images of the object; a second device; a processing unit to receive the sequence of images and determine depth information in response to parameters of the camera and the second device; one or more temperature sensors; and a thermal correction unit responsive to temperature information from the one or more temperature sensors to adjust one or more of the calibration parameters of the first camera and the second device.

公开(公告)号：US09874742B2

公开(公告)日：2018-01-23

申请号：US14865757

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Israel Petronius ,  Barak Freedman ,  Sagy Bareket ,  Arnon Hirshberg

IPC: G02B26/08 ,  G02B7/182 ,  H05K1/02 ,  B81B7/02 ,  H05K1/11

CPC classification number: G02B26/0833 ,  B81B7/02 ,  G02B7/1821 ,  H05K1/028 ,  H05K1/111 ,  H05K1/189

Abstract: An apparatus for micro-electro-mechanical (MEMS) reinforcement is described herein. The apparatus includes a MEMS device and a stiffener. A micro scale mirror is to be embedded in a top layer of a substrate of the MEMS device. The stiffener is to be coupled to a back side of the MEMS device, wherein the stiffener is to stiffen the MEMS device via support of the MEMS device, without increasing a thickness of the MEMS device.

公开(公告)号：US20170090183A1

公开(公告)日：2017-03-30

申请号：US14865757

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Israel Petronius ,  Barak Freedman ,  Sagy Bareket ,  Arnon Hirshberg

IPC: G02B26/08 ,  G02B7/182 ,  H05K1/02 ,  B81B7/02 ,  H05K1/11

CPC classification number: G02B26/0833 ,  B81B7/02 ,  G02B7/1821 ,  H05K1/028 ,  H05K1/111 ,  H05K1/189

Abstract: An apparatus for mirco-electro-mechanical (MEMS) reinforcement is described herein. The apparatus includes a MEMS device and a stiffener. A micro scale mirror is to be embedded in a top layer of a substrate of the MEMS device. The stiffener is to be coupled to a back side of the MEMS device, wherein the stiffener is to stiffen the MEMS device via support of the MEMS device, without increasing a thickness of the MEMS device.