公开(公告)号：US20150369761A1

公开(公告)日：2015-12-24

申请号：US14735168

申请日：2015-06-10

Applicant: Jordan Valley Semiconductors Ltd.

Inventor： Paul Anthony Ryan ,  John Leonard Wall ,  Matthew Wormington

IPC: G01N23/205 ,  G01N23/20

CPC classification number: G01N23/2055 ,  G01N23/20025 ,  G01N2223/6116 ,  G01N2223/6462

Abstract: An apparatus for X-ray topography includes a source assembly, a detector assembly, a scanning assembly and a processor. The source assembly is configured to direct multiple X-ray beams so as to irradiate multiple respective regions on a sample, wherein the regions partially overlap one another along a first axis of the sample and are offset relative to one another along a second axis of the sample that is orthogonal to the first axis. The detector assembly is configured to detect the X-ray beams diffracted from the sample and to produce respective electrical signals in response to the detected X-ray beams. The scanning assembly is configured to move the sample relative to the source assembly and the detector assembly along the second axis. The processor is configured to identify defects in the sample by processing the electrical signals, which are produced by the detector assembly while the sample is moved.

Abstract translation: 用于X射线形貌的装置包括源组件，检测器组件，扫描组件和处理器。 源组件被配置为引导多个X射线束以便照射样品上的多个相应区域，其中所述区域沿着样品的第一轴线部分地彼此重叠，并且沿着样品的第二轴线相对于彼此偏移 与第一轴正交的样品。 检测器组件被配置为检测从样本衍射的X射线束并且响应于检测到的X射线束产生相应的电信号。 扫描组件被配置为沿着第二轴线相对于源组件和检测器组件移动样本。 处理器被配置为通过处理在样品移动时由检测器组件产生的电信号来识别样品中的缺陷。

公开(公告)号：US20130089178A1

公开(公告)日：2013-04-11

申请号：US13647408

申请日：2012-10-09

Applicant: Jordan Valley Semiconductors Ltd.

Inventor： Isaac Mazor ,  Alex Tokar ,  Boris Yokhin ,  Matthew Wormington

IPC: G01N23/223

CPC classification number: H01L22/12

Abstract: A method for inspection includes irradiating, with a focused beam, a feature formed on a semiconductor wafer, the feature including a volume containing a first material and a cap made of a second material, different from the first material, that is formed over the volume. One or more detectors positioned at different angles relative to the feature are used to detect X-ray fluorescent photons that are emitted by the first material in response to the irradiating beam and pass through the cap before striking the detectors. Signals output by the one or more detectors at the different angles in response to the detected photons are processed in order to assess a quality of the cap.

Abstract translation: 一种用于检查的方法包括用聚焦光束照射形成在半导体晶片上的特征，所述特征包括容纳第一材料的体积和与所述第一材料不同的第二材料制成的帽，所述第二材料形成在所述体积 。 使用相对于特征以不同角度定位的一个或多个检测器来检测由第一材料响应于照射束而发射的X射线荧光光子，并在撞击检测器之前穿过盖。 处理由响应于检测到的光子以不同角度输出的一个或多个检测器的信号，以便评估盖的质量。