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    Biodegradable mixed polymeric micelles for drug delivery
    11.
    发明授权
    Biodegradable mixed polymeric micelles for drug delivery 有权
    用于药物递送的可生物降解的混合聚合胶束

    公开(公告)号：US06410057B1

    公开(公告)日：2002-06-25

    申请号：US09713904

    申请日：2000-11-16

    Applicant: Young Kweon-Choi ,  Jin Seok Kim

    Inventor： Young Kweon-Choi ,  Jin Seok Kim

    IPC: A61K950

    CPC classification number: A61K9/1075 ,  A61K47/6907 ,  A61K48/00 ,  C12N15/88

    Abstract: A biodegradable carrier for delivery of a selected bioactive molecule into a targeted host cell containing an amphiphilic polyester-polycation copolymer and an amphiphilic polyester-sugar copolymer. The carrier is particularly useful for delivery of a negatively charged bioactive molecule such as a nucleic acid. The invention improves delivery efficiency by providing a particulate gene carrier for which the particle size and charge density are easily controlled by various means. Various kinds of ligands and other functional compounds may be also be introduced to the carrier. The carrier may be used for delivering a targeted host cell with a bioactive molecule.

    Abstract translation: 用于将选定的生物活性分子递送到含有两亲性聚酯 - 聚阳离子共聚物和两亲性聚酯 - 糖共聚物的靶宿主细胞中的生物可降解载体。 载体对于递送带负电荷的生物活性分子例如核酸特别有用。 本发明通过提供通过各种方式容易地控制粒度和电荷密度的颗粒基因载体来提高递送效率。 还可以将各种配体和其它官能化合物引入载体中。 载体可用于用生物活性分子递送靶向宿主细胞。

    RF SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    13.
    发明申请
    RF SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF 审中-公开
    RF半导体器件及其制造方法

    公开(公告)号：US20110163413A1

    公开(公告)日：2011-07-07

    申请号：US12984041

    申请日：2011-01-04

    Applicant: Ki Joong Kim ,  Jin Seok Kim ,  Kwang Sic Kim ,  Youn Suk Kim ,  Young Sik Kang ,  Tae Joon Park

    Inventor： Ki Joong Kim ,  Jin Seok Kim ,  Kwang Sic Kim ,  Youn Suk Kim ,  Young Sik Kang ,  Tae Joon Park

    IPC: H01L27/06 ,  H01L21/02

    CPC classification number: H01L27/016 ,  H01L23/5223 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/66 ,  H01L28/20 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    Abstract: A radio frequency (RF) semiconductor device includes a semiconductor substrate, a resistor film formed at one area of the semiconductor substrate, a first metal layer formed on the semiconductor substrate, a dielectric layer formed at least on the lower electrode film, a second metal layer formed on the dielectric layer, a first insulating layer having a first pad via connected with the first metal layer, a capacitor via connected with the second metal layer, and an inductor via connected with the first or second metal layer. a third metal layer includes filling parts that fill the capacitor via and the inductor via, respectively, and a second circuit line. A second insulating layer is formed on the first insulating layer to have a second pad via connected with the first pad via. A bonding pad is formed at the first and second pad vias.

    Abstract translation: 射频（RF）半导体器件包括半导体衬底，形成在半导体衬底的一个区域上的电阻膜，形成在半导体衬底上的第一金属层，至少在下电极膜上形成的电介质层，第二金属 形成在电介质层上的第一绝缘层，具有与第一金属层连接的第一焊盘通孔的第一绝缘层，与第二金属层连接的电容器通孔，以及与第一或第二金属层连接的电感器通路。 第三金属层包括分别填充电容器通孔和电感器通孔的填充部分和第二电路线。 第二绝缘层形成在第一绝缘层上，以具有与第一焊盘通孔连接的第二焊盘。 在第一和第二焊盘通孔处形成接合焊盘。

    Flange for fuel pump module and manufacturing method thereof
    19.
    发明授权
    Flange for fuel pump module and manufacturing method thereof 有权
    燃油泵模块法兰及其制造方法

    公开(公告)号：US08656588B2

    公开(公告)日：2014-02-25

    申请号：US13028661

    申请日：2011-02-16

    Applicant: Ha Young Cho ,  Jae Won Choi ,  Jin Seok Kim

    Inventor： Ha Young Cho ,  Jae Won Choi ,  Jin Seok Kim

    IPC: B23P17/00 ,  B29C45/14 ,  B31B1/60

    CPC classification number: F02M37/106 ,  F02M37/103 ,  F02M2037/228

    Abstract: Disclosed is a flange for a fuel pump module, which includes an adhesion enhancing member so that there is no gap between a power supply terminal and a resin material for forming a flange, thus further increasing injection efficiency and sealing performance. A method of manufacturing such a flange is also provided.

    Abstract translation: 公开了一种用于燃料泵组件的凸缘，其包括粘合增强构件，使得在供电端子和用于形成凸缘的树脂材料之间不存在间隙，因此进一步提高了喷射效率和密封性能。 还提供了制造这种凸缘的方法。

    MOTOR STRUCTURE
    20.
    发明申请
    MOTOR STRUCTURE 审中-公开
    电机结构

    公开(公告)号：US20140015360A1

    公开(公告)日：2014-01-16

    申请号：US13923057

    申请日：2013-06-20

    Applicant: Jin Seok Kim

    Inventor： Jin Seok Kim

    IPC: H02K5/16

    CPC classification number: H02K5/161 ,  H02K5/1672 ,  H02K5/1732 ,  H02K5/24

    Abstract: Disclosed herein is a motor structure including a case provided with a predetermined inner space defined by coupling of a front housing and a rear housing, a rotor arranged within the case and provided with a circular yoke to which a plurality of magnets is mounted, a rotating shaft having a predetermined length and coupled to a center of the rotor, one end of the rotating shaft penetrating the front housing and the other end of the rotating shaft provided with a hole formed in a longitudinal direction of the rotating shaft, a stator spaced a distance apart from the rotor and provided with a coil wound therearound and surrounding the rotor, and a support arranged at the rear housing and inserted into the hole of the rotating shaft to support the rotating shaft to allow the rotating shaft to rotate.

    Abstract translation: 这里公开了一种电动机结构，其包括具有通过前壳体和后壳体的联接而限定的预定内部空间的壳体，布置在壳体内并具有安装有多个磁体的圆形轭的转子，旋转 轴，其具有预定长度并且连接到所述转子的中心，所述旋转轴的一端穿过所述前壳体，所述旋转轴的另一端设置有沿所述旋转轴的纵向方向形成的孔，定子间隔开 离开转子并设置有缠绕在其周围的绕组并围绕转子的距离，以及布置在后壳体处并被插入旋转轴的孔中的支撑件，以支撑旋转轴以允许旋转轴旋转。

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