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79 条记录 (耗时 0.028 秒)

    Jetting Device with Reduced Crosstalk
    11.
    发明申请
    Jetting Device with Reduced Crosstalk 有权
    具有减少串扰的喷射装置

    公开(公告)号：US20110234668A1

    公开(公告)日：2011-09-29

    申请号：US12749269

    申请日：2010-03-29

    申请人： Paul A. Hoisington ,  Christoph Menzel ,  John A. Higginson ,  Andreas Bibl ,  Kevin von Essen

    发明人： Paul A. Hoisington ,  Christoph Menzel ,  John A. Higginson ,  Andreas Bibl ,  Kevin von Essen

    IPC分类号： B41J29/38 ,  B41J2/045

    CPC分类号： B41J2/055 ,  B41J2/14233 ,  B41J2002/14362 ,  B41J2202/12 ,  Y10T29/42

    摘要： A printing device for jetting a liquid includes a flow path body having a plurality of jetting flow paths, a liquid in the plurality of jetting flow paths, a piezoelectric actuator associated with each jetting flow path, a feed substrate having a plurality of fluid inlets, and a driver configured to apply a voltage pulse to the piezoelectric actuator. The first jetting flow path is adjacent to the second jetting flow path and a fluidic travel distance from the piezoelectric actuator of the first jetting flow path to a nozzle of the second jetting flow path is greater than a speed of sound in the liquid times the break off time of a droplet of the fluid from the nozzle.

    摘要翻译： 用于喷射液体的打印装置包括具有多个喷射流路的流路主体，多个喷射流路中的液体，与每个喷射流路相关联的压电致动器，具有多个流体入口的进料基板， 以及被配置为向压电致动器施加电压脉冲的驱动器。 第一喷射流路与第二喷射流路相邻，并且从第一喷射流路的压电致动器到第二喷射流路的喷嘴的流体行进距离大于液体中的声速超过断裂 来自喷嘴的流体液滴的关闭时间。

    METHOD AND APPARATUS FOR MOUNTING A FLUID EJECTION MODULE
    12.
    发明申请
    METHOD AND APPARATUS FOR MOUNTING A FLUID EJECTION MODULE 有权
    用于安装流体喷射模块的方法和装置

    公开(公告)号：US20110128324A1

    公开(公告)日：2011-06-02

    申请号：US12991758

    申请日：2009-05-06

    申请人： Kevin von Essen ,  Stephen R. Deming ,  John A. Higginson ,  Nobuo Matsumoto ,  Andreas Bibl

    发明人： Kevin von Essen ,  Stephen R. Deming ,  John A. Higginson ,  Nobuo Matsumoto ,  Andreas Bibl

    IPC分类号： B41J2/16

    CPC分类号： B41J2/14 ,  B41J2/175 ,  B41J29/393 ,  B41J2002/14362

    摘要： A system and method for mounting a fluid droplet ejection module to a frame is disclosed, where the fluid ejection module includes a mounting component having a mounting surface. A connector is configured to detachably attach to the frame and is positioned between the frame and the mounting surface of the fluid ejection module. A portion of a mating surface of the connector is positioned adjacent the mounting surface of a corresponding fluid ejection module and is in direct contact with the mounting surface. One or more recesses are formed in at least one of either the mounting surface of the fluid ejection module or the mating surface of the connector. The one or more recesses have a substantially uniform thickness and are filled with an adhesive. The adhesive is cured after aligning the fluid ejection module to the frame.

    摘要翻译： 公开了一种用于将流体液滴喷射模块安装到框架的系统和方法，其中流体喷射模块包括具有安装表面的安装部件。 连接器被构造成可拆卸地附接到框架并且被定位在框架和流体喷射模块的安装表面之间。 连接器的配合表面的一部分邻近相应的流体喷射模块的安装表面定位并且与安装表面直接接触。 一个或多个凹部形成在流体喷射模块的安装表面或连接器的配合表面中的至少一个中。 一个或多个凹部具有基本均匀的厚度并且填充有粘合剂。 粘合剂在将流体喷射模块对准框架后固化。

    FLEXIBLE CIRCUIT STRETCHING
    13.
    发明申请
    FLEXIBLE CIRCUIT STRETCHING 审中-公开
    柔性电路拉伸

    公开(公告)号：US20110122587A1

    公开(公告)日：2011-05-26

    申请号：US12991890

    申请日：2009-04-30

    申请人： Stephen R. Deming ,  Kevin von Essen ,  Andreas Bibl ,  John A. Higginson ,  Micheal Rocchio

    发明人： Stephen R. Deming ,  Kevin von Essen ,  Andreas Bibl ,  John A. Higginson ,  Micheal Rocchio

    IPC分类号： H05K1/18 ,  H01L21/58 ,  H05K3/00

    CPC分类号： H05K1/118 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/10674 ,  H05K2203/0271 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/5313

    摘要： A method of connecting electrical components and an electronic device formed using this method are disclosed. This method includes stretching a first substrate with a plurality of conductive traces to form a stretched substrate where at least one increased pitch (a spacing between two conductive traces plus a width of one conductive trace) is not greater than 40 microns; and electrically connecting the conductive traces on the first substrate to conductive traces on a second substrate. A device by which this method can be implemented is also disclosed, which includes a base, and platforms and stretchers mounted to the base that are configured to pull opposite ends of the first substrate to align the conductive traces thereon with the conductive traces on the second substrate.

    摘要翻译： 公开了一种连接电气部件的方法和使用该方法形成的电子设备。 该方法包括用多个导电迹线拉伸第一衬底以形成延伸的衬底，其中至少一个增加的间距（两个导电迹线之间的间隔加上一个导电迹线的宽度）不大于40微米; 以及将第一衬底上的导电迹线电连接到第二衬底上的导电迹线。 还公开了一种可以实现该方法的装置，其包括安装到基座的基座和平台和拉伸器，其被配置为拉动第一基板的相对端部，以使其上的导电迹线与第二基板上的导电迹线对准 基质。

    Non-wetting Coating on Die Mount
    14.
    发明申请
    Non-wetting Coating on Die Mount 审中-公开
    模具上的非润湿涂层

    公开(公告)号：US20110080449A1

    公开(公告)日：2011-04-07

    申请号：US12572929

    申请日：2009-10-02

    申请人： Kevin von Essen ,  John A. Higginson ,  Andreas Bibl

    发明人： Kevin von Essen ,  John A. Higginson ,  Andreas Bibl

    IPC分类号： B41J2/165 ,  B41J2/135 ,  B32B37/02

    CPC分类号： B41J2/14 ,  B41J2/145 ,  B41J2/1606 ,  B41J2202/19 ,  Y10T156/10

    摘要： Printing devices are described that have a printing die with a coplanar adjacent layer. The coplanar adjacent layer is sufficiently non-wetting to fluids that the layer can be easily wiped clean of fluid that is inadvertently deposited thereon. A non-stick surface is optionally applied to the adjacent layer which can withstand both mechanical and chemical abrasion that can be caused by corrosive ejection fluids or wiping mechanisms.

    摘要翻译： 描述了具有具有共面相邻层的印刷模具的印刷装置。 共面相邻层对于流体是非常不湿润的，该层可以容易地擦拭被无意中沉积在其上的流体。 任选地将不粘表面施加到相邻层，其可承受由腐蚀性喷射流体或擦拭机构引起的机械和化学磨损。

    Mounting assembly
    17.
    发明授权
    Mounting assembly 有权
    安装组件

    公开(公告)号：US07413284B2

    公开(公告)日：2008-08-19

    申请号：US11117146

    申请日：2005-04-27

    申请人： John A. Higginson ,  Andreas Bibl ,  Kevin Von Essen

    发明人： John A. Higginson ,  Andreas Bibl ,  Kevin Von Essen

    IPC分类号： B41J2/14

    CPC分类号： B41J2/1752 ,  B41J2/145 ,  B41J2/175 ,  B41J2202/12 ,  B41J2202/14 ,  B41J2202/19 ,  B41J2202/20

    摘要： A mounting assembly is described for mounting and housing printhead modules. The mounting assembly includes a lower plate, an upper plate and multiple mounting blocks. The lower plate can include openings configured to expose a surface of a printhead module housed within the mounting assembly, the surface including multiple ink nozzle openings. Each opening can include alignment datums to align the printhead module in a first direction and in a second direction. The upper plate is approximately parallel to the lower plate, and can include multiple openings configured to provide access to ink channels formed in printhead modules housed within the mounting assembly. The mounting blocks are positioned between and affixed to the lower and upper plates, and are configured to couple to a printhead module. Each mounting block can include a datum to align the printhead module in a third direction.

    摘要翻译： 描述了用于安装和封装打印头模块的安装组件。 安装组件包括下板，上板和多个安装块。 下板可以包括被配置为暴露容纳在安装组件内的打印头模块的表面的开口，该表面包括多个墨水喷嘴开口。 每个开口可以包括对准基准，以将打印头模块沿第一方向和第二方向对齐。 上板近似平行于下板，并且可以包括多个开口，其被构造成提供对容纳在安装组件内的打印头模块中形成的油墨通道的通路。 安装块定位在下板和上板之间并固定到下板和上板，并且被配置成联接到打印头模块。 每个安装块可以包括在第三方向上对准打印头模块的基准。

    Bonded circuits and seals in a printing device
    18.
    发明授权
    Bonded circuits and seals in a printing device 有权
    印刷装置中的接合电路和密封

    公开(公告)号：US08297742B2

    公开(公告)日：2012-10-30

    申请号：US12728020

    申请日：2010-03-19

    申请人： Kevin Von Essen ,  John A. Higginson ,  Andreas Bibl

    发明人： Kevin Von Essen ,  John A. Higginson ,  Andreas Bibl

    IPC分类号： B41J2/045

    CPC分类号： B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/14362 ,  B41J2202/03 ,  Y10T29/49401

    摘要： A fluid ejection device includes a circuit layer having a fluid outlet on a lower surface, a chamber substrate having a fluid inlet on an upper surface, an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer, and a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate. The seal and the electrical contact are a eutectic material. The seal and the electrical contact may be the same material.

    摘要翻译： 流体喷射装置包括在下表面上具有流体出口的电路层，具有在上表面上的流体入口的腔室基底，将腔室基底电连接到电路层的下表面的电接触，以及密封形成 电路层的流体出口和腔室衬底的流体入口之间的流体连接。 密封和电接触是共晶材料。 密封和电接触可以是相同的材料。

    FLEXIBLE PRINTHEAD CIRCUIT
    20.
    发明申请
    FLEXIBLE PRINTHEAD CIRCUIT 有权
    柔性打印机电路

    公开(公告)号：US20090066758A1

    公开(公告)日：2009-03-12

    申请号：US12271707

    申请日：2008-11-14

    申请人： Kevin Von Essen ,  Antai Xu ,  Andreas Bibl ,  John A. Higginson

    发明人： Kevin Von Essen ,  Antai Xu ,  Andreas Bibl ,  John A. Higginson

    IPC分类号： B41J2/14

    CPC分类号： B41J2/14072 ,  B41J2002/14491 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/053 ,  H05K2201/10689

    摘要： A flexible circuit for use within a printhead assembly and to connect a printhead body to an external circuit includes a substantially planar portion having one or more layers of conductive material and having a top surface substantially parallel to a top surface of the printhead body. One or more integrated circuits can be mounted onto the planar portion. Multiple leads extend from each integrated circuit, the leads electrically connected to the printhead body. One or more arms are attached to, and substantially perpendicular to, the planar portion, each arm including one or more external connectors configured to connect to the external circuit.

    摘要翻译： 用于打印头组件内并将打印头主体连接到外部电路的柔性电路包括具有一层或多层导电材料并且具有基本上平行于打印头主体顶表面的顶表面的基本上平面的部分。 一个或多个集成电路可以安装在平面部分上。 多个引线从每个集成电路延伸，引线电连接到打印头主体。 一个或多个臂附接到并且基本上垂直于平面部分，每个臂包括被配置为连接到外部电路的一个或多个外部连接器。