Damping solution for offset printing
    11.
    发明授权
    Damping solution for offset printing 失效
    胶版印刷阻尼剂

    公开(公告)号:US4970138A

    公开(公告)日:1990-11-13

    申请号:US284243

    申请日:1988-12-14

    IPC分类号: B41N3/08

    CPC分类号: B41N3/08

    摘要: An aqueous damping solution for the offset printing process contains a hydrolysis product of a compound of the general formula ##STR1## wherein R.sup.1 and R.sup.2 are identical or different and are each hydrogen, alkyl of 1 to 9 carbon atoms or aryl of 6 to 12 carbon atoms, or a condensate of this hydrolysis product.

    摘要翻译: 用于胶版印刷方法的水性阻尼溶液包含通式为(I)的化合物的水解产物,其中R 1和R 2相同或不同并且各自为氢,1至9个碳原子的烷基或6的芳基 至12个碳原子,或该水解产物的缩合物。

    Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate
    12.
    发明申请
    Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate 有权
    用于制造从衬底的后部进入的微机械膜结构的方法

    公开(公告)号:US20110147864A1

    公开(公告)日:2011-06-23

    申请号:US12737037

    申请日:2009-04-21

    IPC分类号: H01L21/302 H01L29/84

    摘要: A method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate includes: n-doping at least one contiguous lattice-type area of a p-doped silicon substrate surface; porously etching a substrate area beneath the n-doped lattice structure; producing a cavity in this substrate area beneath the n-doped lattice structure; growing a first monocrystalline silicon epitaxial layer on the n-doped lattice structure; at least one opening in the n-doped lattice structure being dimensioned in such a way that it is not closed by the growing first epitaxial layer but instead forms an access opening to the cavity; an oxide layer being created on the cavity wall; a rear access to the cavity being created, the oxide layer on the cavity wall acting as an etch stop layer; and the oxide layer being removed in the area of the cavity.

    摘要翻译: 用于制造从衬底的后部进入的微机械膜结构的方法包括:n掺杂p掺杂硅衬底表面的至少一个连续的格子型区域; 在n掺杂的晶格结构下面蚀刻衬底区域; 在该n型掺杂晶格结构下面的该衬底区域中产生空腔; 在n掺杂晶格结构上生长第一单晶硅外延层; n掺杂晶格结构中的至少一个开口的尺寸设计成使得其不被生长的第一外延层闭合​​,而是形成到腔的通路口; 在空腔壁上形成氧化物层; 产生到空腔的后部通路,空腔壁上的氧化层用作蚀刻停止层; 并且在空腔的区域中去除氧化物层。