Reducing Registration Error of Front and Back Wafer Surfaces Utilizing a See-Through Calibration Wafer
    11.
    发明申请
    Reducing Registration Error of Front and Back Wafer Surfaces Utilizing a See-Through Calibration Wafer 有权
    使用透视校准晶圆减少前后晶片表面的配准误差

    公开(公告)号:US20140313516A1

    公开(公告)日:2014-10-23

    申请号:US13864701

    申请日:2013-04-17

    Abstract: A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.

    Abstract translation: 公开了一种用于校准干涉仪系统的校准晶片和方法。 校准方法包括:基于两个相对强度的帧确定校准晶片中限定的孔的位置; 比较孔的位置与使用外部测量装置测量的位置; 至少部分地基于比较结果调整第一光学倍率或第二光学倍率; 基于孔的位置的比较来定义第一和第二强度帧中的每一个的失真图; 通过映射拟合失真图来生成第一和第二强度帧中的每一个的扩展失真图; 以及利用所述第一和第二强度帧中的每一个的所述扩展失真图来减少随后测量过程中的注册误差或光学失真中的至少一个。

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